TI's Cool Power

Author:
Reported by Cliff Keys, Editor-in-Chief, Power Systems Design

Date
09/18/2010

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New power MOSFETs with reduced top-side thermal impedance for high-current DC/DC applications

I talked with Jeff Sherman, TI's Product Marketing Engineer for Texas Instruments' Power Stage business, based in North Carolina, about the company's new DualCool™ NexFET™ power MOSFETs which offers up to 80% higher power dissipation and up to 50% more current in a standard footprint. In February 2009, TI acquired Bethlehem, Pennsylvania-based CICLON Semiconductor Device Corporation for its innovative, high-efficiency power management solutions. Adding the NexFET power MOSFETs to TI's existing power management portfolio has enabled TI to provide its customers with complete solutions for high efficiency power supply designs. DualCool™ NexFET power MOSFETs mark the first new power MOSFET offering from TI since this vital industry acquisition.

Texas Instruments has now launched the industry's first family of standard-footprint power MOSFETs that dissipate heat through the top of the package for high-current DC/DC applications. DualCool™ NexFET™ power MOSFETs reduce end equipment size, while providing up to 50% more current through the MOSFET and improving thermal management over other standard-footprint packages. See: www.ti.com/dualcool-preu.

This new family of five NexFET devices allows computing and telecom system designers to use higher current processors with expanded memory while saving board space. These MOSFETs in an advanced package can be used in a wide range of end applications including desktop personal computers, servers, telecommunications or networking equipment, basestations, and high current industrial systems. Jeff explained that many customers now demand higher current DC/DC power supplies in a smaller footprint to meet the urgent need for increased processing power in the broad infrastructure market. The new DualCool NexFET power MOSFETs meet this need with the unique ability to conduct more current within the same form factor. Key features and benefits of DualCool NexFET power MOSFETs:

  • Single phase 35A synchronous buck converter MOSFETs, using single MOSFETs for both the high and low side switches in high-current DC/DC applications.
  • Enhanced packaging technology reduces thermal impedance to top of package from 10° to 15°C per watt to 1.2°C per watt, increasing power dissipation capability by up to 80%.
  • Efficient dual-side heat sinking enables up to 50% more current through the FET, giving designers the flexibility to use higher current processors without increasing end equipment size.
  • Industry-standard SON package with a 5mm x 6mm footprint eases design and keeps cost down, saving 30mm2 compared to using two standard packages.

DualCool NexFET devices are available in volume now from TI and its authorized distributors. Suggested resale pricing for the CSD16325Q5C is $1.47 in 1,000-unit quantities. Samples and application notes are available.

www.ti.com

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