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Figure 1: Half-cell diagrams of the N-Channel SJMOSFET (a) and N-Channel VDMOSFET (b)
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Figure 1. 2013 Honda Accord Touring/Hybrid LED DRL & Headlamp
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Figure 1. DOE proposed regulations vs. Level V performance for a 5V output EPS.
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Figure 1: Daylight harvesting energy savings
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Figure 1. Forward operating mode of SBR structure
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Figure 1: Conventional vertical power loop PCB layout (a) Side view (b) MOSFET top view (c) eGaN FET top view
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Figure 1: Qi wireless-charging system simplified block diagram
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Figure 1: Hall-effect sensors can mount in three locations: inside the motor, at the end of the motor's shaft, and around the rotor shaft's ring magnet.
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Figure 1: Shoot through due to drive-signal timing mismatch
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Figure 1: Low-cost power supply providing a regulated 1.8 V and 2.5 V using a step-down converter and auxiliary charge pump
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Figure 1: Transformers that utilize the auto-zigzag construction can perform the delta to wye transformation without the efficiency loss of an isolation transformer.
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Figure 1: The SignalGuru application from MIT and Princeton, saves drivers an average of 20% fuel costs compared to those that had to stop at traffic lights.
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Figure 1: Typical CPU section and firmware memory map
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Figure 1: Projected relative cost of LED Luminaire and percentage due to the cost of LEDs (Source: DOE SSL 2011 Manufacturing Roadmap)
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Figure 1: A typical PoE system
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Figure 1: A network topology for wind-farm applications makes use of redundant devices and cabling to maximize system uptime and minimize the operational consequences of single points of failure.
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Figure 1: Shading and current distribution inside the solar module
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Figure 1: Wholesale energy prices will be increasingly driven by the weather.
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Figure 1: Micrel's MIC94300 integrated design reduces the combined footprint of filter and load switch by as much as 65%.
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Figure 1: Active Network Management creates a new layer of grid management.
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Figure 1: Inductor-current waveform
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Figure 1: SOA (a) and ZthJC (b) charts for the BSC014N04LS
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Figure 1: The DiSEqC application circuit
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Figure 1: Emerson Rosemount's 3051S series wireless instrumentation exemplifies the benefits WSN brings to industrial applications: It can reduce total installation costs by 45% and total deployment time by as much as 75%, eliminating design and installation time and cost associated with wiring, conduit, cable trays, and junction boxes.
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Table 1: SiC MOSFET and Si IGBT comparative specifications
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Table 1: The LTC2376 through 2380 pin-compatible family of differential, no-latency SAR ADCs are available in 16- and 18-bit versions.
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Figure 1: Transmission line circuit illustrating the impedance mismatch boundary between the transmission line and the load. Reflections occur at the boundary designated by ?. The incident wave is V+ and the reflective wave is V-.
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Figure 1: Optimising transient response parameters via a digital-power GUI.
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Figure 1: General usability-engineering design cycle
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Figure 1: Southampton hands. Across each palm can be seen a dc motor with a worm and wheel to rotate the thumb. Five other motors flex and extend the fingers and thumb. The fingertips have touch (force), slip/texture, and temperature sensors.
Figure 1: The 8-bit data registers in the SPI Master and Slave devices link through the MISO and MOSI signals to form a 16-bit control register. (Click image to enlarge.)
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Table 1: Process-control measures
Figure 1: The local-dimming function saves 10 to 20% of power on edge-lit systems (left) and 20 to 30% of power on direct back-lit TVs (right).
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Figure 1: Relative active power
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Figure 1a: Two TRIACs operating near their Tj(max): The BTB16-600CW standard TRIAC (a) and the T1635H-6T high-temperature TRIAC (b).
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Figure 1: Redundant 8.46 kV lines power an industrial customer's facility.
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Figure 1: Micro-inverters convert direct current from individual solar panels into alternating current for the electric grid.
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Figure 1: A conscientious life-cycle design will consider threats at every step of product development and manufacturing.
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Figure 1: Each stage of embedded-software validation for electric-motor simulation introduces new challenges for test engineers such as high-speed processing and high-power signals.
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Figure 1: EpiGaN deposits a unique in-situ SiN capping layer, grown by MOCVD on top of HEMT epi wafers.
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Figure 1: Functional blocks for amsï½s two-chip sensor interface for high-side automotive battery current sensing.
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Figure 1: An example of a shielded air-core open-loop current sensor from Raztec provides a strong combination of high performance in a small package and at low cost.
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Figure 1: Integrated gate driver with external passive components.
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Figure 1: Block diagram of a typical EPIC sensor
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Figure 1: Typical HEV system block diagram
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Figure 1: CAN network with partial-networking controllers during the transmission of a message to ECU7 (without partial-networking support)
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Figure 1: Communication line card primary ICs and power supply requirements
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Figure 1: A typical AES design includes power sources sharing a common high-voltage DC Link, an inverter for generating AC, and a system controller ensuring coordinated operation.
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Figure 1: Step-down converter efficiency used to power the main processor in a set top box
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Figure 1: The principle of fuel gauging based on coulomb counting: The stored energy represents state of charge. A circuit measures the in- and out-flowing current.
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Figure 1: Converter input power vs. line current with a symmetric conduction angle, constant current peak and resistive load.
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Figure 1: The activation steps of the MHP device
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Figure 1: Lighting controls for next generation lighting.
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Figure 1: Incandescent light bulbs (blue curves) are purely resistive, LEDs (red curves) are not.
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Figure 1: The LT3791 Driving a 3 A LED Array at up to 100 W
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Figure 1: Modern robotic systems featuring sophisticated multi-axis arms are adding to factory productivity and safety. Simply picking up an object can require several sensors.
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Figure 1: Resonant driver for high-power LED-lighting applications.
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Figure 1: One-Stage Approach: The driver converts an AC-rectified line voltage to the necessary DC current through a flyback transformer and filter. Unfortunately, the rectified voltage contains ripple at twice the line frequency (100 or 120 Hz).
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Figure 1: Development of CNA ASICs
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Table 1: Test comparison for PI Loops
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Figure 1 : Measured efficiency of a high frequency 12 Vin to POL buck converter, including output filter losses, using low voltage GaN based power devices.
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Figure 1: AMIS-30522 Functional Block Diagram
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Figure 1. Block Diagram of the ISL29028A ambient light and proximity sensor
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Figure 1: Different PFC circuits
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Figure 1: Example PLD, with 12 inputs, 8 product terms and 4 macrocells
PLDs can have hundreds of macrocells with up to 16 product terms driving each macrocell. The AND and OR gates within the product terms can be interconnected to form highly flexible custom logic functions. The macrocells are typically clocked, and their outputs can be fed back into the product term array. This allows state machines to be created.
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Figure 1 - Development of Converged Network Adapter ASICs
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Figure 1: Difference between a DCP and SDP
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Figure 1: Typical application circuit, using 2 AA batteries and a regulator IC, the AS1337, to produce a 3.3V output
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Table 1. IEC 61000-3-2 Classifications
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Figure 1. A flyback converter's main common-mode noise sources and transfer paths.
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At least two power reactors are needed for solar inverters: one in the boost converter (step-up chopper) and one at the ouput of the inverter for EMC filtering. Besides the IGBTs, the losses in the reactors are a major determining factor of the overall efficiency of the inverter
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Figure 1: NetRiver desired a solution capable of easily scaling to match its unpredictable future growth.
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Figure 1: High output current 1.5V/50A application schematic
