Wide-Bandgap Semis

Current
Revolutionizing Power Electronics: Silver Adhesive Pastes for Next-Gen Semiconductor Reliability and Thermal Performance

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Figure 1: Silver adhesive paste for die-bonding

­As power electronics evolve with the rise of wide-bandgap semiconductors like silicon carbide (SiC) and gallium nitride (GaN), the demand for advanced die bonding solutions becomes increasingly critical. Die bonding solutions enable power systems that operate at significantly higher switching frequencies, de
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Date:
03/01/2026
Gate Driver Power Supply Challenges for SiC and GaN Devices

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Figure 1: A few of the many RECOM DC/DC modules optimized for WBG gate driver applications

­Silicon Carbide (SiC) and Gallium Nitride (GaN) are wide‑bandgap (WBG) semiconductor materials offering advantages over traditional silicon (Si) in power electronics because they switch faster with lower losses. They are gaining significant market share in applications where high efficiency and power density ar
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Date:
03/01/2026
Silicon Reinvented: Architectural Innovations Beyond SuperJunction Power MOSFETs

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Figure 1: The evolution of semiconductor architectures from HEXFET (left) to SuperJunction (middle) and the latest SuperQ technology (right), with dielectric charge-balancing structure shown in red

­In the 1970s, the 1D power MOSFET, aka HEXFET™, was introduced. The 1980s saw the launch of the IGBT, and in the 1990s, reduced surface field (RESURF) devices – aka SuperJunction™ devices were introduced. Over the last two decades, improvements in silicon power devices have been largely evolutionary rather th
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Date:
03/01/2026
The State of the Merchant Power Supply Market in 2026

Kevin Parmenter, Pins Out Engineering, for TSC America, Inc.

­The total revenue of the power supply market, valued at $37.24 billion in 2024, is expected to grow at a CAGR of 4.73% from 2025 to 2032, reaching nearly $ 53.90 billion, according to Maximize Market Research’s latest forecast. The merchant power supply market, comprising standalone power conversion products
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Date:
03/01/2026