Technical Features

May 2011
High-Density Power Modules Simplify and Downsize EV Power System Design

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Figure 1: Replacing conventional, discrete power conversion with power modules throughout the vehicle provides significant cost and weight savings in EVs

­The electrification of the automobile is presenting new challenges for power system designers in achieving the highest power density at the lowest weight possible, eliminating compromises in vehicle range and overall performance. Designers of power delivery networks (PDNs) are also tasked with designing safe, effici
Date:
10/31/2024
Digital POL Improves Key Metrics

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Digital power conversion has moved on from being a novelty to widespread acceptance. Ericsson launched its BMR453 quarter-brick intermediate-bus converter in 2008 and followed with an eighth-brick
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Date:
05/26/2011
Direct Fuel Injection

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Figure 1: Estimated junction temperature rise for a given power pulse assuming an inductive load

There is a pressing need within the automotive industry for realizing greater degrees of fuel economy. This is being driven by rising oil prices through ongoing political uncertainty in many oil
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Date:
05/26/2011
Superior Assembly Technology

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Figure 1: Al Bondwire

Power module development is striving for higher power densities, not only in new but also in already established packages. Two main challenges for such kinds of upgrades are to meet the increased
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Date:
05/26/2011
SMD Cube Shrinks Footprint

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With their ability to drastically simplify provision of low-power isolated power rails that are commonly required in applications such as process control and industrial communications interfaces,
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Date:
05/26/2011
Pain Management in Power Optimization

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Figure 1: Benefit of In-Design Technology in IC Design

Power has always been an integral part of consumer electronics, but increasingly we can do more things with a single device. That trend, above all others, has moved power consumption from an afterthought
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Date:
05/26/2011
Increasing Efficiency

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The Intelligent Power Module, IPM, has been a mainstay in motor speed control designs. And with good reason: Such designs are relatively easy and cheap to implement. With onboard gate drivers,
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Date:
05/26/2011
Reliability in White Goods

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Figure 1: RX210 Block diagram

The demands being placed on designers for the next generation of domestic appliances are increasing drastically. Today we see many conflicting demands to use less power, less water and to create
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Date:
05/11/2011
Automated Control

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Figure 1 - Supplies are margined by changing the resistor connected to the Trim/FB node

Modern appliances and equipment which utilize microprocessors, FPGAs and other complex ICs require accurate power supply voltages, often more accurate, in fact, than the tolerances provided by
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Date:
05/11/2011
Cost Competitive SiC

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Figures 1 &2: Forward conduction characteristics comparison

Silicon carbide (SiC) is a compound semiconductor that is superior to silicon (Si) in several respects. These advantages stem from SiC's ~10x higher critical breakdown field, ~2.8x higher thermal
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Date:
05/11/2011
Integration in Embedded HMI

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Figure 1: Thermostat with resistive- and capacitive-touch technologies

HMI designs in embedded systems are evolving fast as the cost of manufacturing fashionable and more elegant interfaces continues to decrease. Some appliances are already combining touch-sensitive
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Date:
05/11/2011
Circuit Protection Considerations

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Figure 1: Typical circuit protection design for switch-mode power supplies

The power supplies, relays and other electronic components found in household and professional-grade appliances can benefit from the application of resettable overcurrent protection. Polymeric
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Date:
05/11/2011
White Goods Technology

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Figure 1: Simplified Block Diagram of Washing Machine

The rising cost of electricity will increase the consumer demand for home appliances that offer energy savings. However, this is only one consideration that consumers must consider when purchasing
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Date:
05/11/2011
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