Technical Features

    Current
    Eliminating the EMI Design Cycle in High-Voltage Defense Power Systems

    Figure 1: CE102 limits for MIL-STD-461. From the limits shown for 28V systems, we can see that at 500kHz and above, the limit is 1mV into 50Ω

    ­Today's defense electronics need high-voltage-to-SELV conversion at unprecedented power levels and board densities. The specific challenge is converting 270V to a 28V or 48V bus while still meeting MIL-STD-461 conducted emissions limits (EMI), a requirement that is both a technical problem and a program schedule
    Date:
    10/28/2026
    Asset Investment Under Fire as the Wildfire Season Approaches: How Utilities are Taking Action!

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    Figure 1: Wildfires have proven to cause catastrophic damage to communities, infrastructure, and the wider environment, putting citizen lives, and billions of dollars at risk

    ­Wildfires have proven to cause catastrophic damage to communities, infrastructure, and the wider environment, putting citizen lives, and billions of dollars at risk. Utilities are under immense pressure to make capital decisions that minimize the damage, whether it be heavy infrastructure hardening or operation
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    Date:
    11/01/2026
    A Better Battery Starts at the Cathode

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    Figure 1: Pouch cells built to evaluate performance, cycle life, and safety characteristics

    ­Global battery demand is experiencing exponential growth, driven by electric vehicles, data center backup power, and grid-scale energy storage. Currently, the battery market surpasses $150 billion. Battery manufacturers face mounting pressure to improve performance while simultaneously reducing costs, en
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    Date:
    11/01/2026
    Designing the Thermal Path for a Baseplate-Cooled Power Supply

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    Figure 1: The CCR420 (left) combines baseplate cooling with heat dissipation to the surrounding air while the ASB320 (right) is designed principally for conduction cooling through its baseplate

    ­Choosing a baseplate-cooled power supply is only part of the thermal design. The baseplate provides a thermal path for losses from heat-generating components, but what happens beyond that point depends on the equipment in which the supply is installed. The baseplate may be coupled to a chassis, a cold wall or
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    Date:
    11/01/2026
    Hardware-in-the-Loop Testing Supports eVTOL Certification

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    Figure 1: Model-based design workflows allow system models to be deployed to real-time hardware-in-the-loop platforms for closed-loop controller validation

    ­Electric vertical take-off and landing (eVTOL) aircraft are at the center of the transition to electrified propulsion and distributed aircraft architectures, and they form the technological foundation of the urban air mobility (UAM) sector. Recent industry analysis estimates that the advanced air mobility ma
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    Date:
    11/01/2026
    The Advantages of Migrating from Planar Rad Hard MOSFETs to Superjunction Topology

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    Figure 1: Illustrating the differences in power architectures

    ­For decades, planar-topology MOSFETs have been the workhorse of radiation-hardened (rad-hard) applications, providing a foundation for robust power management in critically important systems that must perform flawlessly in the harshest of environments. These environments include outer space, high-altitude fl
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    Date:
    11/01/2026
    How MEMS-Based Circuit Breaker Are Redefining AI Data Center Power Distribution

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    ­Recent McKinsey analysis projects that global data center capacity demand could nearly triple by 2030, driven by the rapid scaling of AI workloads and the resulting structural shift in compute architecture across hyperscale and enterprise infrastructure. For power infrastructure providers, this expansion represents no
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    Date:
    11/01/2026
    AI's Power Problem Is a Passive-Component Problem

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    Figure 1: With AI data-centre power consumption scaling toward thousands of terawatt-hours, overall system efficiency is increasingly decided in the power delivery network between the grid and the processor

    ­AI has become the single most important driver of data-centre electricity demand. According to the International Energy Agency's “Energy and AI” report, published in April 2025, data centres worldwide drew around 415 terawatt-hours in 2024, roughly 1.5 percent of global electricity demand. In the agency's base
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    Date:
    11/01/2026
    Minimising Noise in High-Current Applications

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    Figure 1: Noise measurement block diagram

    ­Conventional step-down switching regulators have several sources of noise that affect low-frequency (<100kHz) performance. Most critical noise sources include feedback voltage reference, error amplifier, noise from the resistor divider used to set the output voltage, and noise gain created by this resistor di
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    Date:
    11/01/2026
    Archive

    Eliminating the EMI Design Cycle in High-Voltage Defense Power Systems

    Oct 28,2026
    Josh Gertz, VP of Engineering at Northwest Power, a Vicor company

    Low-Loss Inductors for High-Efficiency Power Converters

    Sep 29,2026
    Annika Frankemölle; Editor: Gerhard Stelzer, Würth Elektronik

    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

    Aug 31,2026
    Jeffrey Cumabig, Product Application Engineer, and Lei Song, Product Definition Engineer, both for gate drivers at Infineon Technologies AG

    Silicon Carbide Semiconductors: Gaining Widespread Adoption

    Jul 30,2026
    Jens Baringhaus, Chief Expert for Wideband Gap Technology and responsible for Bosch's SiC technology roadmap

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