Powering AI

November 2024
Overland AI Partners with XVIII Airborne Corps to Integrate Ground Autonomy into Engineering Operations

20th Engineer Brigade’s S-MET operating autonomously with Overland AI’s autonomy kit and OverDrive stack. The S-MET also integrated a breaching payload (the trailer) using Overland AI’s custom-built, autonomous hitch.

­Overland AI is proud to announce a collaboration with the 20th Engineer Brigade, XVIII Airborne Corps, to push the limits of autonomous breaching. In a recent experimentation event, Operation ARTEMIS CROWN, the company integrated its OverDrive stack and Overland AI’s autonomy kit on a Small Multipurpose Eq
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Date:
11/26/2024

Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

­Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs). The new DDR5 MRDIMMs are
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Date:
11/21/2024
Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan

Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan

To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology (Nasdaq: MCHP) has released its PolarFire® FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform.  PolarFire FPGAs enable mu
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Date:
11/14/2024
onsemi Introduces the Industry’s Most Advanced Analog and Mixed-Signal Platform

onsemi Introduces the Industry’s Most Advanced Analog and Mixed-Signal Platform

­Today, onsemi introduced the Treo Platform, an analog and mixed-signal platform built with Bipolar-CMOS-DMOS (BCD) process technology on an advanced 65nm node. This platform provides the foundation for a wide range of power and sensing solutions from onsemi including high-performance and low-power sensing, hi
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Date:
11/11/2024
Navitas Presents World's First 8.5kW AI Data Center Power Supply Powered by GaN and SiC

Navitas Presents World's First 8.5kW AI Data Center Power Supply Powered by GaN and SiC

­Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, has announced the world’s first 8.5 kW power supply unit (PSU), powered by GaN and SiC technologies to achieve 98% efficiency, fo
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Date:
11/07/2024
Web-Based Tool from STMicroelectronics Accelerates AIoT Projects with Smart Sensors

Web-Based Tool from STMicroelectronics Accelerates AIoT Projects with Smart Sensors

ST AIoT Craft, a new web-based tool from STMicroelectronics, simplifies developing and provisioning node-to-cloud AIoT (Artificial Intelligence of Things) projects that use the machine-learning core (MLC) of ST’s smart MEMS sensors. The MLC is unique to the ST MEMS portfolio and enables decision-tree learning
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Date:
11/05/2024
SEGGER SystemView Now Free for Select Ultra Low Power Microcontrollers from Analog Devices

SEGGER SystemView Now Free for Select Ultra Low Power Microcontrollers from Analog Devices

­SEGGER announces that Analog Devices, Inc. (ADI) has made SEGGER’s SystemView software analysis tool available for their customers for select Ultra Low Power (ULP) microcontrollers, free of charge, enabling a powerful out-of-the box development experience. Included are the MAX78000, MAX78002, MAX32561, MA
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Date:
11/05/2024
Next-Gen IBC Series Delivers High Power Density and Efficiency for AI Data Centers

Next-Gen IBC Series Delivers High Power Density and Efficiency for AI Data Centers

­Flex Power Modules introduces the BMR316, a high-performance non-isolated, unregulated DC/DC intermediate bus converter (IBC) specifically designed for AI and ML data center applications that demand intensive computational power. The compact BMR316 is ideal for other high-power IBC applications where board spa
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Date:
11/04/2024
Is AI a Job Killer or Merely the Next Disruptive Technology?

Jason Lomberg, North American Editor, PSD

­Artificial Intelligence, AI, has the potential to transform our world in a way that few disruptive technologies have. While other tech innovations have made our lives easier, we’re potentially planting the seeds of our own obsolescence with AI. But is AI a true tech singularity, upon which we’ll have “passed th
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Date:
11/01/2024
The Power Semiconductor Market

Kevin Parmenter, Director, Applications Engineering. TSC, America

­In August, Frost & Sullivan reported: “Power Semiconductors are experiencing transformational growth due to rapid electrification across industries, the AI boom, growing renewable energy demand, and focus on sustainability.” From 2023 to 2033 the forecasted cumulative growth opportunity for power semiconductors is
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Date:
11/01/2024
Power Delivery Considerations for HPC/AI Devices

Click image to enlarge

Figure 1: HPC devices for AI application demand a significant amount of power

­With the insatiable need for more power, high-performance computing (HPC) products create challenges for test cells in delivering and managing high power during manufacturing test.  According to data from Market.us, the global computing power market is forecasted to grow from $45.7 billion in 2023 to $8
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Date:
11/01/2024