As the industry’s first TLVR quad‑phase module in this compact form factor, the Infineon TDM24745T power module offers up to 320 A peak current capability.
Danisense Introduces new High Precision DC and AC Current Clamp-On
Power Integrations Extends Flyback Topology to Enable 440 W, Offering Simpler Alternatives to Resonant Power Designs
Renesas' New GaN Charging Solution Delivers 500W of Power to Wide Range of Industrial and IoT Electronics
Lars Erik Lunøe, CEO Umoe Advanced Composites shakes hands with Alistair Tippett, Hiringa Head of Projects and Engineering at Hiringa Energy.
SimpleChips Ships Industry's First 1200V High-Voltage Monitor IC
Advanced Energy Launches AIF13WAC, 600 W Full-Brick 48 V AC-DC Supply with up to 94% Peak Efficiency
600V Super Junction Power MOSFETs with Built-in Fast-Recovery Diodes for High-Efficiency Power Supply Circuits
Beyond Blue and Green: How Methane Pyrolysis Is Powering Turquoise Hydrogen
Don Reeves, senior vice president of Outcomes at Itron
Bourns® 75ABF, 75ABM, 76AAF,
76AAM, 78ADF and 78ADM Modular
Contacts
New Economic Study Identifies a $300 Billion Infrastructure Identity Gap in the Built Environment
Omdia: Semiconductor market surpasses $830bn in 2025, driven by AI demand and broad segment growth
Mike Nagus, CEO of LiNova
STMicroelectronics' Single-Chip Buck Converter Packs 3A Power for Appliances and Industrial Loads
Infineon supports faster deployment of humanoid robots as the market accelerates, with solutions that help robots sense, move, act, and connect safely and securely.
Navitas Debuts Revolutionary 800 V–6 V Power Delivery Board
Teradyne Introduces Omnyx: Redefining Board Test for the AI Era
Anglia to Focus on New Business Development and Demand Creation for Digi International in the Nordic and Baltic Regions
UAE Solar Capacity to Reach 32.3GW by 2035, Forecasts GlobalData
Bourns® Model SRN3010BTA-330M Semi-shielded Power Inductors
Andrew Brannan, Managing Director at ArcLight
High-Performance 50 ARMS Three-Phase BLDC Inverter Powered by eGaN
New Jersey BPU Selects Elevate's Garden State Reliability Battery Storage Project to Improve Affordability and Address Regional Power Shortage
Menlo Micro and Rosenberger Announce Strategic Partnership to Advance Cryogenic Switching in Quantum Computing
New Research Shows U.S. Offshore Wind Could Drive $42 Billion Expansion in Domestic Steel Sector, Supporting 186,600 American Jobs
Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement
Validation of the background subtraction algorithm: (1) original frame; (2) intermediate processing removing the bird instance; (3) final binary mask of the feed ROI used for displacement tracking (photo courtesy of Paulista University)
Engineers Look to Mouser Electronics for Wide Selection of STMicroelectronics Products
Team captain Abdul Mujeeb Kassim, far left, presses his buzzer to answer a question. His teammates at the table include, from left, Christopher Arthur, Ivan Baffour Awuah and Nene Belinyo Maimo. Photo courtesy of Kassim
NSW Premier Joins Octopus Australia to Break Ground on $900 Million Blind Creek Solar and Battery Project
Mueller Steam Specialty Launches Strainers with Differential Pressure Monitoring and Automated Blowdown Options
Figure 1: Original claim areas prior to the current staking round.
8 Watt Wide-Input Converters for Industrial Applications
Advanced Energy Launches LPP200 Series of Low-Profile AC-DC Supplies for Miniaturization of Medical and Industrial Devices
NeoCortec Introduces new NeoGW Software and Centralized Network Management Web Application
congatec – the leading vendor of embedded and edge computing technology – is enhancing the performance and scalability of its AMD Ryzen™ AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules
Oben Uluc, Ballard Power System's Sales & Marketing Vice President
Ophelia-IV: flexible developer platform without preinstalled firmware
GE Vernova Expands Manufacturing Capacity in Vietnam to Support Growing Global Electrification Needs
Ching-Wu Chu, University of Houston
Kevin Noonan, President of RESA Power's Canadian business
Dave Carroll, Vice President of Product Management at Same Sky
Nordic Semiconductor Introduces Precise, Adaptive Battery Health-Monitoring to Enable Smarter, Longer‑Lasting IoT Devices
Industry-Lowest RDS(on) 200V MOSFETs in Multiple Standard Power Packages Available from iDEAL Semiconductor
© Deep Space Energy / Bruno Kabucis
STMicroelectronics Accelerates AI-Enhanced Motor Control with Machine-Learning Software Pack
Nordic Semiconductor expands nRF54L Series with entry-level Bluetooth LE SoCs
Pickering Launches Test System Architect to Streamline Signal Path Design and Deployment
Planned construction site of the Shimamaki–Kuromatsunai Wind Farm
(Photo courtesy of Cosmo Eco Power Co., Ltd.)
'Strength and Determination': Scholarship Fuels Embry‑Riddle Student's Flight Success
Infineon CoolGaN Transistors G5 are Adopted by Chicony Power Supplying High-Power Adapters to Leading Notebook Manufacturers
Rodolfo Bitar, VP Business Development, PVH USA
Tom Hunt, Pivot Energy CEO
TDK Introduces Compact ThermoFuse Varistors for Surge Protection of up to 50 kA
Micross Introduces H+ Screened DC-DC Converters for LEO Constellations and New Space Missions
Steve Scharnhorst, CEO of MacLean Power Systems
GameChange BOS Transformers Achieve Short-Circuit Certification, Validating Resilience for Critical Grid Infrastructure
Texas A&M University System celebrated the opening of the STEM Education and Research Center
Trafag Highlights Three Picostat Mechanical Pressure Switches Tailored to Precision in Dynamic Demands
Danisense Achieves Full ISO/IEC 17025 Accreditation for AC Calibration Services
Nordic Semiconductor Accelerates Cellular IoT Leadership with Major new Product Releases
DC emergency power supply solution "Made in Germany": BICKER UPSI-2415DP3 (24V / 15A / 360W) with integrated LiFePO4 high-performance battery pack and USB-C / RS485-Modbus interfaces.
Russia Renewable Capacity to Reach 18.4GW by 2035, Forecasts GlobalData
Jason Lomberg, North America Editor, PSD
Ally Winning, European Editor, PSD
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Figure 1: Silver adhesive paste for die-bonding
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Figure 1: High Power Density vs. High Reliability. An isometric view showing how compact designs increase thermal stress, while spaced layouts enhance cooling and reliability
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Figure 1: ENNOVi-SealTech – ENNOVI’s shrinking method for sealing 3-phase busbars at a lower cost and faster processing time compared to conventional methods
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Figure 1: A few of the many RECOM DC/DC modules optimized for WBG gate driver applications
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Figure 1: The IEEE has evolved PoE standards from 15.4W (802.3af) to 30W (802.3at) and up to 90-100W (802.3bt) to meet rising demand for power-hungry devices
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Figure 1: The evolution of semiconductor architectures from HEXFET (left) to SuperJunction (middle) and the latest SuperQ technology (right), with dielectric charge-balancing structure shown in red
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Figure 1: BDS modes
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Figure 1: A cyclotron application block diagram
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Figure 1: Example autonomous mobile robot (AMR) subsystems
Kevin Parmenter, Pins Out Engineering, for TSC America, Inc.
Jason Lomberg, North America Editor, PSD
Ally Winning, European Editor, PSD
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Figure 1: Typical electronic system requiring eight voltages
