PIC32CM PL10 MCUs Expand Microchip's Arm Cortex-M0+ Portfolio
OmniOn Power Introduces ProLynx II DC/DC Converters for Demanding Industrial Applications
Bourns' AC3028SQ, AC5037SQ,
ACXX14SQ, ACXX15SQ, and ACXX18SQ
Series Air Coil Inductors
Siemens and nVent to Release Joint Reference Architecture Purpose-Built for NVIDIA AI Data Centers
From left to right: Matt Brenn, Director, Community Solar Subscriptions, Pivot Energy; James Pedric, Account Manager, Xcel Energy; Lynn Bailey, Director, Energy, Sustainability & Utilities, DU; Mark DeLorenzo, Senior Vice Chancellor for Business and Financial Affairs, DU....
Offshore Wind Stop-Work Orders are Costing Consumers, Delaying Needed Electricity
Equipmake Secures new £2.4m, 23-Vehicle Zero Emission Electric Bus Drivetrain Supply Deal with Agrale
DTI's New FH Series and SH Series of Higher Power Diodes
Microchip Expands maXTouch M1 Touchscreen Controller Series for Broader Display Size Coverage
Alpha and Omega Semiconductor Unveils its Powerful aMOS E2 600V Super Junction MOSFET Platform
Safe and Easy Surge Protection
It's a Mad, Mad, Mad, Mad 48V World
Henkel Launches Next Generation Polyurethane Potting Solution for Industrial and Power Electronics Reliability
Camilo Serrano, Regional General Manager of Atlas Renewable Energy
STMicroelectronics' Hybrid Controller Simplifies Full-Feature Implementation of USB-C Sink Premium Applications
Dara Ward, Director of Sustainability for CoorsTek
Panasonic Industry Launches its First Flat Lens, High-Performing PIR Sensor
The Triad Semiconductor TS5510 EVK. This Customer Evaluation Board (CEVB) allows fast & efficient bench testing of the TS5510 2-channel Audio AFE. An onboard microcontroller allows gain / attenuation setting (and LCD display) using mechanical encoders, which drives the SPI control lines of the IC.
Cree LED and Blizzard Lighting Enter Settlement and Limited License Agreement
Microchip Introduces 600V Gate Driver Family for High-Voltage Power Management Applications
Rajan Bedi of Spacechips
Magnachip Targets Solar and Energy Storage Systems Markets with New Generation of High-Efficiency IGBT Series
Infineon Launches the Next-Generation of USB 2.0 Peripheral Controller with the EZ-USB FX2G3
Microchip Expands PolarFire FPGA Smart Embedded Video Ecosystem with New SDI IP Cores and Quad CoaXPress Bridge Kit
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Figure 1: Next-generation Grid-to-Core Datacenter Architectures Minimize Energy Conversions
Source: NVIDIA
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Figure 1: A block diagram of the 41/43-725A 6-channel battery simulator module
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Kevin Parmenter, Pins Out Engineering, for TSC America, Inc.
10 Watt Wide-Input Converters for Industrial Applications
Wen Tu, Senior Director of Integrated Planning at PG&E
Chris Cosby, President and CEO of ODEC
SolaHD™ Unveils Enhanced S4KD Industrial Online UPS Series with Rugged Steel Construction and Advanced Power Management for Mission-Critical Applications
Littelfuse Expands Magnetic Sensor Portfolio with Ultra-Low-Power Omnipolar TMR Switches
Cree LED Introduces Fully Assembled L2 PCBA Solutions that Address a Wide Range of Indoor and Outdoor Lighting Use Cases
Yokogawa Announces the North American Launch of OpreX Intelligent Edge Controllers - A8 Model
OLI Selected as an Official Collaborator in the U.S. Department of Energy's Genesis Mission
To keep pace with the dynamic changes in the energy landscape, automation must go hand in hand with digitalization. Only when operators can rely on real-time data and intelligent systems will they be able to ensure the stability and resilience of tomorrow’s grids.
Toshiba Expands Protection Zener Diodes Portfolio with Four new Voltage Ratings up to 75V
AVAIO Digital Announces New Large-Scale AI-Ready Data Center and Power Campus in Little Rock, Arkansas
Antaira has announced its new ultra-flat Ethernet switch, the FNP-0500G-T. Designed for modern control cabinets and space-constrained environments, it offers robust, high-speed connectivity with an installation depth of only 1.24 inches
Russelectric, a Siemens Business, Highlights RTSCD Commercial Duty Service Entrance Rated Transfer Switches
Zac Hendrix, Product Marketing Supervisor, OMRON Electronic Components
Express PTL
“The specification of a module standard for FPGAs opens up new sales channels for semiconductor manufacturers, embedded module manufacturers, and VARs/system integrators, while offering customers all the benefits they may already know from computer-on-modules.” – Ansgar Hein, Chairman
Kaman Announces New Air Gap Tool
Liz Reddington, Vice President of Development at Pivot Energy
Infineon and HL Klemove drive SDV development forward
CNN and NGK Insulators Launch Global Campaign Showcasing Innovation for a Sustainable Future
Morse Micro Announces General Availability of HaLowLink
Silanna Announces MIL-TEMP Variant of Plural Platform ADCs, Delivering −55°C to +125°C Operation Across Portfolio
Infineon AIROC™ ACW741x is the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimized for IoT. This product family provides Wi-Fi 7 Multi-Link for IoT for enhanced robustness in congested environments and has the industry's lowest Wi-Fi connected standby power.
Silanna, Avnet Enter Distribution Partnership for Advanced Plural ADC Portfolio and Ultra-Efficient FirePower Laser Driver ICs
STMicroelectronics Scales STM32 Microprocessors for Cost-Efficient, Low-Power, and Flexible Performance
Menlo Micro Cryogenic Switches Set New Benchmark for RF Switches Within Quantum Computing Systems
TDK Establishes TDK AIsight and Announces New Ultra-Low Power DSP Platform for AI Glasses
Chris Goodall, President of Trusted Positioning, TDK
Allegro MicroSystems Simplifies SiC Power Design for AI Data Centers and EVs with Expanded Power-Thru Gate Driver Portfolio
Menlo Micro and Microchip Technology Validate the First MEMS-Based Hot-Switched Power Panel
Sri Maddipati, Consumers Energy's president of electric supply
Accelerating the mobility transition together (l. to r.): Benjamin Pfeifer (Chief Commercial Officer ioki), Michael Barillère-Scholz (Co-founder and CEO ioki), Tobias Liebelt (CEO Benteler Mobility), Sven Herzig (Chief Sales Officer HOLON).
Happy Holidays and a Wonderful New Year!
Ally Winning, European Editor, PSD
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Figure 1: Flexibility capacity additions to 2050 (Energy Transition Scenario)
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Figures 1a and 1b: Unidirectional and bidirectional charging systems (Source: Bel Fuse)
Ally Winning, European Editor, PSD
Jason Lomberg, North American Editor, PSD
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Figure 1: SerDes, like other technologies, uses an OSI model to define the interactions between layers. All layers of the stack are required for the system to function properly
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Figure 1: Design V diagram showing the connection between simulation and physical test
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Kevin Parmenter, Director Applications Engineering, TSC America
Jason Lomberg, North American Editor, PSD
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Figure 1. Switching a supply line with an N-channel MOSFET and a separate driver circuit, the LTC7003.
