Military, Aerospace & Hi-Rel

May 2019
Vulnerability of Cloud Service Hardware Uncovered

Field-programmable gate arrays (FPGAs) are more flexible than common specialized computer chips -- and they used to be seen as particularly secure.

Field-programmable gate arrays (FPGAs) are, so to say, a computer manufacturer's "Lego bricks": electronic components that can be employed in a more flexible way than other computer chips. Even large data centers that are dedicated to cloud services, such as those provided by some big technology companies, oft
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Date:
05/31/2019
Compact Size SMD Package CAN/RS485/RS232 Transceiver Modules
The transceivers assist fast signal response in industries of power grid, industrial control, and transportation(rail, automotive), etc. The series adopt the SMT process, which enables customers to easily achieve automated processing, and greatly reduce costs. Compared with the traditional DIP package, its board
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Date:
05/30/2019
Ultra-thin Open Frame Non-isolated DC-DC Converter
The dimension of K78-JT-500R3 series is 12.50 x 13.50 x 3.50mm, which is 4.75mm lower in height than that of K78-T-500R3 series. Besides, the K78-JT-500R3 series features SMD package, and provides an ultra-wide input voltage range of 4.75 - 36V. This series also eliminates the need for a heat sink and its oper
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Date:
05/30/2019
10 Watt DC-DC Converter Range in Compact Package
The new series comprises 14 variants. Targeting a diverse range of applications, including instrumentation, data communication, telecommunication and computer peripheral equipment, industrial automation and mobile battery-powered systems, the compact form factor of the ATA series minimizes occupied board sp
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Date:
05/30/2019
Rugged 2KW RF power LDMOS transistor for ISM applications
The process has been developed to enable the implementation of extremely rugged transistors with operating voltages of up to 65V. The first product to use the process, the ART2K0FE, is a 2KW transistor with a frequency response of 0 to 650MHz, offered in an air-cavity ceramic package. It is designed to with
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Date:
05/30/2019
Extended range of reliable and efficient DC-DC converters
The modules are provided in sealed and encapsulated packaging, to ensure they will work reliably when subjected to dust, moisture, severe vibration and other harsh conditions. The PKE3000 and PKE5000 series provide highly reliable, high-performance and rugged DC-DC solutions in the industry-standard 1 x 1in
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Date:
05/30/2019
A Safer Supply Chain with Vincotech’s Multi-sourced Offering
This supplier of module-based solutions for power electronics pointed out that its multiple sourcing strategy goes to protect customers’ business interests by mitigating risks in the supply chain. Vincotech has qualified all leading manufacturers under an open and flexible vendor policy. This also gives cus
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Date:
05/30/2019
This series is optimized for industrial applications including street lamps, commercial AC systems, and general-purpose AC servos and inverters used in high power equipment. SiC power semiconductors deliver greater power efficiency, miniaturization, and higher voltage capability than the existing Si power d
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Date:
05/30/2019
200A current sense transducer costs 40% less than competition
This enables users to access Danisense’s unique, double-core, balanced flux gate measurement technology, at a very affordable price/performance ratio. The DC200IF boasts excellent linearity (6 ppm) with a maximum offset of 5ppm, equivalent to 1.5mA. The units provide DC and AC current metering with +/- 0.1
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Date:
05/30/2019
LEM introduces AI-PMUL digital integrator for Rogowski coils
AI-PMUL is a versatile digital signal conditioner of Rogowski coils secondary signal which offers a wide range of standard analogue True RMS and instantaneous outputs. The Rogowski coils output voltage is proportional to the derivative of primary current. An electrical integrator circuit is therefore necessary to conv
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Date:
05/30/2019
Exagan Opens Power Solutions Center in Europe
The opening of the best-in-class facility, which is operating in close collaboration with technology partner CEA Tech, follows the launch of Exagan’s first GaN applications center in Taiwan last October. The Toulouse facility provides customers with new application-development and product-validation capabili
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Date:
05/30/2019
WiBotic and GaN Systems Bring ‘True Autonomy’ to Mobility
The partnership advances capabilities of mobile industrial robots, freeing them from limitations imposed by current restricted charging methods that allow for continuous operation. For mobile robots to work efficiently, flexibly, and without interruption - they need to achieve true autonomy with wireless charging
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Date:
05/30/2019
Versatile Boost Controller for LED/LCD Applications
The device supplies a constant voltage or constant current to drive displays and backlights with a dimming ratio of 100:1. It is well suited for use as a backlight driver for LCD TVs, LCD monitors, and flat panel displays, as well as an LED driver for commercial lighting applications. The AL3353 is a mu
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Date:
05/30/2019
HybridPACK power modules enable fast vehicle electrification
The four new HybridPACK Drive modules are optimized for different inverter performance levels between 100 kW and 200 kW. Furthermore, Infineon’s HybridPACK Double Sided Cooling (DSC) S2 is a technology upgrade to the existing HybridPACK DSC. This module targets main inverters up to 80 kW in hybrid and plug-in
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Date:
05/30/2019
Ultra-wide input EN 50155 DC/DC converters
The DC/DC converters serve a wide range of rolling-stock applications, as well as high-voltage battery-powered systems with their ultra-wide 14V-160V DC input-voltage range. The single-output 40W and 60W quarter-brick converters accept all commonly used supply voltages, from nominal 24V DC to 110V DC. They feature basi
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Date:
05/30/2019
SiC-Based Hybrid IGBT and Isolated High Current IGBT Gate Driver
The AFGHL50T65SQDC uses the latest field stop IGBT and SiC Schottky diode technology to offer low conduction and switching losses in multiple power applications, including those that will benefit from reduced reverse recovery losses, such as totem pole based bridgeless power factor correction (PFC) and inverters.
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Date:
05/30/2019
3 Phase input, 5kW AC-DC power supply is software configurable
The range features both ITE/industrial and medical agency approvals that feature a three-phase, three-wire, 180 to 528VAC input. This drastically simplifies installation as there is no need for a neutral connection, which is often not available in industrial applications. Inbuilt digital control allows the setting of both th
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Date:
05/30/2019
Microchip Carbide (SiC) products for reliable power electronics
Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products. These products meet the need to improve system efficiency, robustness and power density in Electric Vehicles (EVs) and other high-power applications in the i
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Date:
05/30/2019
CIPOS Tiny complements Infineon’s families of IPMs
The 3-phase inverter module is the newest generation of IPM to offer the highest power density for variable speed motor drives. By using the latest TRENCHSTOP IGBT6, it is possible to realize maximum efficiency with minimum footprint. Applications profiting from CIPOS Tiny include high efficiency washing machi
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Date:
05/30/2019
Mouser stocking Bourns GMOV Hybrid Components
GMOV components present a long-life, reliable protection solution that provides a higher level of performance and safety compared to standard metal oxide varistors (MOVs). The Bourns GMOV series are ideal in AC applications where conditions are less than predictable or uncontrolled, in markets such as industrial,
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Date:
05/30/2019
Driver Cuts Satellite Command & Telemetry System Size by 50%
TOKYO, Japan – Renesas Electronics Corporation announced a new radiation-hardened 16-channel current driver with integrated 4-bit decoder for reducing the size, weight and power (SWaP) of satellite command and telemetry systems. The ISL72814SEH integrates the decoder, input level shifter, and 16 current driv
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Date:
05/30/2019
Graphene to Enable Future Space Exploration

Graphene Flagship researchers during one of the zero-gravity experiments.

Researchers embark on zero-gravity parabolic flights to test novel graphene-based thermal management devices for space applications. Graphene significantly improves the performance of loop heat pipes, which dissipate heat in satellites to avoid equipment failure. The Graphene Flagship aims to get thes
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Date:
05/29/2019
Open Frame Power Supplies with UL8750 Safety Approval
    The LU225 family meets EN55015 (EN55032) Class B Conducted EMI, IEC61000-3-2 Class C (LED dimming) and EN60950 standards, and is one of the first open frame power supplies in the industry to feature UL8750 approval for LED equipment. An active inrush current limit capability of 15 A also min
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Date:
05/22/2019
High Power Factor LED Driver-Controller with Mixed-Mode Dimming
  The AL1665 is designed to drive an external MOSFET to control LED loads and maintain a high power factor. It provides a compact and efficient solution that helps minimize the use of additional components and maintains high switching efficiency.   Designed to operate from an AC input voltage
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Date:
05/22/2019
Eight-port switch supports new IEEE 802.3bt PoE standard
        Ideal for digital ceiling installations, the IEEE 802.3bt-compliant PDS-408G PoE switch runs noise-free with a fanless design.   Designed for enterprise connected lighting applications, the PDS-408G connects separate systems such as lighting, sensors, HVAC and W
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Date:
05/22/2019
High Temperature Micro-D Series connectors available at TTI
Optimised to save space and weight in demanding applications, such as space vehicles, defence systems and oil exploration equipment, Micro Series Connectors are rugged and moisture-sealed. These data, power and signal interconnects combine versatility with high performance and high reliability and are designed to b
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Date:
05/22/2019
LTM2810 µModule Isolators, Now Shipping from Mouser
      The LTM2810 µModule isolators are suitable for test and measurement equipment, medical equipment, electric vehicle (EV) and hybrid electric vehicle (HEV) systems, industrial applications, and metering systems.   The Analog Devices LTM2810 µModule isolators, available
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Date:
05/22/2019
Low profile 180W U-channel PSU for space-critical applications
The low-profile devices are just 1.16” high and occupy a small 4.3” x 2.5” footprint, allowing them to be used in high-density designs. The units are suitable for Class I and Class II operation and offer 2 x MOPP (Means of Patient Protection) of isolation while delivering up to 94% efficiency.  
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Date:
05/22/2019
Samtec’s mPOWER Ultra Micro Power Connectors Now at Mouser
Offering current ratings up to 21 A per blade in a 2 mm pitch, mPOWER connectors provide an ultra-small, high-power solution with exceptional design flexibility for power-only or power-and-signal applications. Samtec’s mPOWER connector system, available from Mouser Electronics, features gold-plated power blades a
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Date:
05/22/2019
Infineon scales up production and rolls out of CoolSiC MOSFETs
        They are rated from 30 mΩ to 350 mΩ and implemented into TO247-3 and TO247-4 housings. The expansion includes a surface mount device (SMD) portfolio and a 650 V CoolSiC MOSFET product family, both to be launched soon. With these products, Infineon addresses the fast grow
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Date:
05/22/2019
New CoolSiC Schottky diode 1200 V G5 portfolio from Infineon
It can easily replace silicon diodes for higher efficiency. The expanded 8.7 mm creepage and clearance distances offer extra safety in high-pollution environments. Forward currents up to 40 A are available to address EV DC charging, solar energy systems, uninterruptible power supply (UPS) and other industrial applicat
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Date:
05/22/2019
Complete Range of Switcher ICs with Integrated 900 V MOSFETs
      The newly released devices include ICs for high-efficiency isolated flyback power supplies and for simple non-isolated buck converters. Applications include three-phase industrial power supplies up to 480 VAC, and high-quality consumer products destined for regions with unstable m
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Date:
05/22/2019
UnitedSiC adds 7 SiC FETs to 650V product portfolio
These new devices provide new levels of high-voltage power performance in the fast growing data center server, 5G base station, and electric vehicle markets, where they will be used in power supplies, telecom rectifiers, and on-board chargers respectively. The new devices will appeal to designers who prefer a 3-lead, TO
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Date:
05/22/2019
8 x 8mm LFPAK MOSFET family delivers up to 48x power density
LFPAK88 devices replace larger power packages such as D²PAK and D²PAK-7, and measuring 8 x 8mm offer a footprint reduction of 60 %, and a 64 % lower profile.   Unlike other packages where performance is often limited by internal bond wires, LFPAK88 devices employ the copper-clip and solder die at
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Date:
05/22/2019
Current transducers with measuring range up to 450 Apk
The family consists of three new models: LZSR 100-P, LZSR 150-P and LZSR 200-P.   These new transducers are based on LEM’s latest leading-edge ASIC technology, which has been proven in the past launched LF xx10, LH, LxSR current transducer series. Used in a closed loop mode, the ASIC based on Hall effec
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Date:
05/22/2019
Saft Launches new Xcelion 56V Li-ion Battery
Tampa, FL – Saft has recently launched a new product in the Xcelion line, the Xcelion 56V lithium-ion (Li-ion) battery, offering customers a variant on the proven technology behind the Xcelion 6T for applications requiring higher voltage. As the third Xcelion product, the Xcelion 56V builds upon the existi
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Date:
05/20/2019
MIT and US Air Force Sign Agreement to Launch AI Accelerator
MIT and the U.S. Air Force have signed an agreement to launch a new program designed to make fundamental advances in artificial intelligence that could improve Air Force operations while also addressing broader societal needs. The effort, known as the MIT-Air Force AI Accelerator, will leverage the expertise
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Date:
05/20/2019
Thermal Gap Filler Reduces Stress on Sensitive Components
CLEVELAND, Ohio. – Laird Performance Materials has developed Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components while also yielding low thermal resistance
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Date:
05/09/2019
DC-DC Converter Series Featuring GaN-Based Technology
WASHINGTON -- VPT, Inc. released its SGRB Series of space qualified DC-DC converters at the Satellite 2019 Show. Using advanced GaN technology, the SGRB is capable of very high efficiency, up to 95%, as well as radiation tolerance. A fixed-frequency reduced voltage switching topology results in very low in
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Date:
05/06/2019
SiC Devices Enable High-Voltage Power Electronics
CHANDLER, Ariz. — Demand is growing for SiC power products that improve system efficiency, robustness and power density in automotive, industrial and aerospace and defense applications. Microchip Technology Inc., via its Microsemi subsidiary, announced the production release of a family of SiC power devices th
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Date:
05/03/2019
Are you SiC of Silicon? - Part 2

Click image to enlarge

Anup Bhalla, Vice President Engineering, UnitedSiC

State of SiC Device and Package Technology It has long been known that packaging technology is key to unleashing the potential of wide-bandgap (WBG) devices. Silicon Carbide device manufacturers have been making rapid improvements in device technology figures of merit such as on-resistance per unit area (Rds
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Date:
05/01/2019
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