IoT & Smart Cities

March 2025

Figure 1: Reference schematic of a buck converter Vin = 24 V; Vout = 5 V

Annika Frankemölle, Alexander Lang / Editor: Gerhard Stelzer, Würth Elektronik

Increasing current densities and short switching times in MOSFETs are placing ever greater stress on the dielectric strength of inductors. Molded inductors with a distributed air gap based on iron powder enable high inductance values in the smallest of spaces and thus increase the power density. A new test con

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Date:

03/31/2025

Vantron Unveils Cutting-Edge VT-USB-AH-8108 Wi-Fi HaLow Dongle Powered by Morse Micro

Vantron, a leader in embedded IoT solutions, has today announced the launch of the VT-USB-AH-8108 Wi-Fi HaLow Dongle. Powered by Morse Micro’s latest MM8108 chipset, this compact yet powerful device is set to revolutionize IoT connectivity with its superior performance, efficiency, and plug-and-play us

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Date:

03/13/2025

Microchip Technology Unveils 32-bit MCU Family with Integrated High-Performance Analog Peripherals

To address the increasing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology has released the PIC32A family of MCUs. Enhancing the company’s already robust 32-bit MCU portfolio, PIC32A MCUs are designed to be cost-efficient, high-performance so

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Date:

03/11/2025

SGP32 Remote Provisioning Firmware Being Added to all SIMCom LTE Cat 1 bis IoT Modules

SIMCom, a leading provider of cellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by

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Date:

03/11/2025

The OptiMOS TDM2454xx quad-phase power modules enable true vertical power delivery (VPD) and offer industry's best current density of 2 Ampere per mm².

Infineon Unveils Next Generation of High-Density Power Modules for Vertical Power Delivery in AI Data Centers

Infineon Technologies AG, global semiconductor leader in power systems and IoT, launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance computing. Through enhanced system performance and with Infineon’s trademark robustness, the new OptiMOS™ TD

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Date:

03/10/2025

Superior Stability and Ultra Low-Power Consumption with Aker’s 1.2V TCXO Series

Aker Technology USA, a global manufacturer of innovative, competitively priced frequency control products, has released the TX21ED Series, a 1.2V Temperature Compensated Crystal Oscillator (TCXO) that is the ultimate choice for next-generation low-power applications in an era of energy-efficient an

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Date:

03/06/2025

STMicroelectronics Reveals STM32U3 Microcontrollers Extending Ultra-Low Power Innovation for Remote, smart and Sustainable Applications

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced new STM32U3 microcontrollers (MCUs) with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations. The latest MC

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Date:

03/05/2025