Industrial

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Infineon’s industrial microcontrollers XMC7000 enable seamless data exchange and control of automation systems

Infineon and RT-Labs Integrate Six Key Industrial Communication Protocols into XMC7000 Microcontroller Family

As the industry embraces digital transformation and the principles of Industry 4.0, communication protocols in industrial automation are becoming more important than ever. To enable seamless data exchange and control in automation systems, Infineon Technologies AG, together with its partner RT-Labs, a provider of

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Date:

03/21/2025

Danisense Launches new Transducer Electronic Datasheet Functionality

Danisense, the leader in high-accuracy current sense transducers for demanding applications, is launching a new Transducer Electronic Datasheet (TEDS) functionality for its range of current transducers to further streamline lab testing processes. For test engineers, the new TEDS offers a much enhanced se

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Date:

03/21/2025

Alpha and Omega Semiconductor Adds Two New Advanced MOSFET Package Options for High-Current Applications

Alpha and Omega Semiconductor Limited (AOS) announced the release of two state-of-the-art surface mounting package options for its industry-leading high power MOSFET portfolio. Designed to meet the robust packaging requirements for the most demanding applications that require increased performance and reliabi

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Date:

03/12/2025

Modular and integrable: 24V DC UPS solution with UPSI-2406 and LiFePO4 high-performance battery pack BP-LFP-1375S (99Wh)

24V DC UPS Solution for Industrial, Medical and Smart Infrastructure Applications

Bicker Elektronik, Donauwoerth/Germany, introduces a modular DC UPS solution for safety-critical systems in industrial, medical and smart infrastructure applications. The 24V DC uninterruptible power supply with CE-certified LiFePO4 battery pack ensures fail-safe operation during power outages, voltage dips or

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Date:

03/11/2025

Microchip Technology Unveils 32-bit MCU Family with Integrated High-Performance Analog Peripherals

To address the increasing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology has released the PIC32A family of MCUs. Enhancing the company’s already robust 32-bit MCU portfolio, PIC32A MCUs are designed to be cost-efficient, high-performance so

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Date:

03/11/2025

The Antaira LMP-1204G-SFP-bt-T-CC is a conformally coated 802.3bt PoE++ industrial Ethernet switch designed to operate in demanding conditions while ensuring reliable PoE power delivery

Enhancing Ethernet Switch Reliability with Antaira Corrosion-Resistant Conformal Coatings

Choosing a hardened, corrosion-resistant Ethernet switch is critical to preserving industrial control system performance and dependability in settings like chemical plants, wastewater treatment plants, seaports, or traffic monitoring locations. This article explores practical strategies for reducing the risk

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Date:

03/07/2025

STMicroelectronics Reveals STM32U3 Microcontrollers Extending Ultra-Low Power Innovation for Remote, smart and Sustainable Applications

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced new STM32U3 microcontrollers (MCUs) with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations. The latest MC

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Date:

03/05/2025

LLC Switcher IC From Power Integrations Delivers 1650 W of Continuous Output Power

Power Integrations announced a two-fold increase in power output from the HiperLCS™-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up to 1650 W of continuous output power with over 98 percent efficiency. The new family member ta

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Date:

03/05/2025

KYOCERA AVX Introduces Competitive new Compression Contacts

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new 9258-100 Series spring-finger board-to-board compression contacts. Designed to provide full connector functionality in a miniature, low-profi

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Date:

03/03/2025

Click image to enlarge

Figure 1. Six D2PAK MOSFETs with a total footprint area of 1,107 mm2

Using Fewer Parallel MOSFETs to Meet Thermal Demands

Christopher Liu, Aanas Sayed, and Aniket Kulkarni, Nexperia

Today's automotive and industrial applications are faced with ever increasing performance demands. Power applications like inverters for electric vehicles (EV) and light electric vehicles (LEV), brushless DC motors, DC-DC converters, power switches and battery management systems can easily dissipate several kil

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Date:

03/01/2025