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    TDK Presents SMD Common-Mode Chokes for up to 80 V/35 A With a Minimized PCB Footprint

    TDK Presents SMD Common-Mode Chokes for up to 80 V/35 A With a Minimized PCB Footprint

    TDK Presents SMD Common-Mode Chokes for up to 80 V/35 A With a Minimized PCB Footprint
    ­TDK Corporation presents the EP21 series (ordering code: B82552J*J021) of flat-wire double chokes. These components are designed for common-mode EMI filtering and are available in an SMD format with dimensions of only 23.8 x 17.7 mm and heights ranging from 21.6 to 22.3 mm. To minimize board space, these components fe
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    Date:
    07/23/2026
    Siemens and Partners Develop Reference Architecture Purpose-Built for NVIDIA AI Data Centers

    Siemens and Partners Develop Reference Architecture Purpose-Built for NVIDIA AI Data Centers

    Siemens and Partners Develop Reference Architecture Purpose-Built for NVIDIA AI Data Centers
    ­Siemens – together with NVIDIA and Fluence, and incorporating nVent-aligned design considerations – has developed an NVIDIA DSX Vera Rubin-aligned reference design that translates NVIDIA’s AI factory vision into a deployable, industrialized electrical, power and controls architecture for hy
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    Date:
    07/23/2026
    High-Performance Module for Physical AI Applications at the Rugged Edge

    High-Performance Module for Physical AI Applications at the Rugged Edge

    High-Performance Module for Physical AI Applications at the Rugged Edge
    ­congatec – a leading provider of embedded and edge computing technology – today introduced its new COM-HPC Client Size C module with AMD Ryzen™ AI Embedded X100 Series processors. The application-ready aReady.COM conga-HPC/cRX1 has been specifically designed for compute-intensive physical AI applications. Fea
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    Date:
    07/23/2026
    Advanced Energy Launches 1100 W PFC Module with the Industry's Highest Power Density in a Half-Brick Form Factor

    Advanced Energy Launches 1100 W PFC Module with the Industry's Highest Power Density in a Half-Brick Form Factor

    Advanced Energy Launches 1100 W PFC Module with the Industry's Highest Power Density in a Half-Brick Form Factor
    ­Advanced Energy Industries, Inc., a global leader in highly engineered, precision power conversion, measurement and control solutions, today announced a new 1100 W board-mounted power factor correction (PFC) module — the industry's first solution of its kind in a half-brick form factor. Advanced Energy’s A
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    Date:
    07/22/2026
    Toshiba Expands Lineup of AEC‑Q101 Compliant 40V N-channel MOSFETs in Small, Thermally Enhanced S-TOGL Package

    Toshiba expands lineup of AEC‑Q101 compliant 40V N-channel MOSFETs in small, thermally enhanced S-TOGL package

    Toshiba Expands Lineup of AEC‑Q101 Compliant 40V N-channel MOSFETs in Small, Thermally Enhanced S-TOGL Package
    ­Toshiba Electronics Europe GmbH (“Toshiba”) has launched the XPJ1R504PB, an automotive-compliant 40V, 120A N-channel power MOSFET housed in the S‑TOGL™ package, expanding its lineup for 12V systems. Target applications include inverters, semiconductor relays, load switches, and motor drives. By adding th
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    Date:
    07/21/2026
    WITT Gas Controls Next‑Generation Dome Pressure Regulators for Demanding Gas Applications

    WITT Gas Controls Next‑Generation Dome Pressure Regulators for Demanding Gas Applications

    WITT Gas Controls Next‑Generation Dome Pressure Regulators for Demanding Gas Applications
    ­WITT Gas Controls, a global leader in gas safety, control, and analysis solutions, has upgraded its proven dome pressure regulator product line with a next-generation design featuring optimized pilot pressure regulators. Engineered to maintain stable working pressure under widely varying flow rates and inlet pr
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    Date:
    07/21/2026
    Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments

    Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments

    Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments
    ­As industrial environments become more automated and connected, demand for Power over Ethernet is rising to enable industrial applications by delivering reliable power and data over a single cable, simplifying deployment and scalability. To offer an industrial-grade solution, Microchip Technology has extended it
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    Date:
    07/16/2026
    EMIS Advanced Single Phase and Three Phase Common Mode Facility Power Line Filters

    EMIS Advanced Single Phase and Three Phase Common Mode Facility Power Line Filters

    EMIS Advanced Single Phase and Three Phase Common Mode Facility Power Line Filters
    ­Global EMC solutions provider EMIS  introduces the SMF911 and TMF911 series of Single Phase and Three Phase Common Mode Facility Power Line Filters, engineered to provide exceptional electromagnetic interference (EMI) and radio frequency interference (RFI) suppression for industrial, commercial, de
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    Date:
    07/13/2026
    Microchip Expands Developer Access with Free MPLAB® XC Compilers and MPLAB Machine Learning Development Suite

    Microchip Expands Developer Access with Free MPLAB® XC Compilers and MPLAB Machine Learning Development Suite

    Microchip Expands Developer Access with Free MPLAB® XC Compilers and MPLAB Machine Learning Development Suite
    ­Microchip Technology has announced that its MPLAB® XC Pro Compilers and MPLAB Machine Learning (ML) Development Suite are now available at no cost to customers. By enabling unlimited installs across individual and team environments, these tools give developers free access to advanced optimization capabilities an
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    Date:
    07/10/2026
    Alpha and Omega Semi Unveils AmpStack Packaging - A Leap Forward in MOSFET Power Density

    Alpha and Omega Semi Unveils AmpStack Packaging - A Leap Forward in MOSFET Power Density

    Alpha and Omega Semi Unveils AmpStack Packaging - A Leap Forward in MOSFET Power Density
    ­Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DF
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    Date:
    07/08/2026
    Infineon Supplies SiC Technology to ADVANTICS, Enhancing Efficiency in Power Converters for Megawatt Charging

    ADVANTICS’ liquid-cooled power conversion platform is based on modular 100 kW building blocks, enabling scalable systems up to the megawatt range.

    Infineon Supplies SiC Technology to ADVANTICS, Enhancing Efficiency in Power Converters for Megawatt Charging
    ­Infineon Technologies AG will supply CoolSiC™ MOSFETs 1200 V and matching dual-channel EiceDRIVER™ 2EDB9259Y gate drivers to ADVANTICS, a technology leader in silicon carbide (SiC) power electronics and advanced control systems, for its new line of liquid-cooled power converters. The solutions enhance ef
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    Date:
    07/08/2026
    Infineon Launches SECORA ID Key S USB, a new Security Solution Supporting FIDO2 and PKI for Secured Logical Access

    SECORA™ ID Key S USB from Infineon is a Java Card™-based solution with USB and NFC connectivity for secured authentication and digital signatures.

    Infineon Launches SECORA ID Key S USB, a new Security Solution Supporting FIDO2 and PKI for Secured Logical Access
    ­Infineon Technologies AG is launching the SECORA™ ID Key S USB, a Java Card™-based solution with USB and NFC connectivity for secured authentication and digital signatures. As the first FIDO-certified Level 3+ solution and compliant with CTAP 2.1, the authenticator enables phishing-resistant, passwordless au
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    Date:
    07/07/2026
    TDK Expands HWS3000 Series with Wide Range Three-Phase Input Model

    TDK Expands HWS3000 Series with Wide Range Three-Phase Input Model

    TDK Expands HWS3000 Series with Wide Range Three-Phase Input Model
    ­TDK Corporation announces the expansion of the 3000 W TDK-Lambda HWS3000 programmable AC-DC power supply series with the introduction of the HWS3000GT4 model. Now available with a new wide-range 340 – 528 Vac three-phase input option, this addition offers engineers greater installation flexibility, improved co
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    Date:
    07/07/2026
    Bourns TVS Diodes Address High‑Surge ESD Protection in DFN‑2 (0402) Footprints

    Bourns® Model CDDFN2‑T3V3SC and CDDFN2‑T5V0SC TVS Diodes

    Bourns TVS Diodes Address High‑Surge ESD Protection in DFN‑2 (0402) Footprints
    ­Bourns announced the Model CDDFN2‑T3V3SC and CDDFN2‑T5V0SC Surface‑Mount Transient Voltage Suppressor (TVS) Diodes, designed to provide ESD, EFT, and surge protection in DFN‑2 (0402) footprints for space‑constrained electronic designs. The bidirectional devices support IEC 61000‑4‑2,‑4‑4, an
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    Date:
    07/02/2026
    Designing an Optimized Input Filter for Buck Converters

    Click image to enlarge

    Figure 1: Basic Buck Converter Circuit (SWA Is On)

    Designing an Optimized Input Filter for Buck Converters
    Oleg Volfson, Staff Field Applications Engineer & Seema Venkatesh, Senior Technical Engineer, Monolithic Power Systems

    ­This article will discuss how to optimize input filter design for application boards that contain single or multiple DC/DC converters on the same voltage bus. An optimized input filter minimizes the cost and component count while ensuring circuit stability, provides EMI compliance, and improves input voltage tra
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    Date:
    07/01/2026
    Floating Ground Hot-Swap Architecture for Data Centers

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    Figure 1: Data Center Power Distribution Architecture Evolution

    Floating Ground Hot-Swap Architecture for Data Centers
    Avishek Pal, and Rakesh Panguloori, Texas Instruments

    The exponential growth of AI, high-performance computing (HPC), and cloud services is driving an unprecedented surge in data center power demands. Traditional 50V DC power distribution architectures, once sufficient for kilowatt-scale IT racks, are rapidly approaching physical and economic limits as AI workloads pu
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    Date:
    07/01/2026
    Ionic Cooling for AI Systems

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    Figure 1: a demonstration of how electrohydrodynamic (EHD) airflow is achieved

    Ionic Cooling for AI Systems
    Dr. Brian Cumpston, Senior Director, Application Engineering at Ventiva

    ­From smartphones and laptops to automotive infotainment and smart IoT devices, the direction of travel is consistent: more functionality, more performance, and more intelligence, delivered in smaller and thinner form factors. For design engineers, this creates a familiar but intensifying challenge, and with ea
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    Date:
    07/01/2026
    Power Without Pause

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    Power Without Pause
    Robin Schneider, PhD, Director of Marketing, Green Cubes Technology

    ­The pressure on industrial and medical equipment manufacturers has never been more intense. Customers demand higher uptime, leaner operating costs, and power systems that adapt to the job rather than dictating its terms. Traditional fixed-battery architectures — solid and predictable as they may be — are in
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    Date:
    07/01/2026
    The Golden Rule of Board Layout for Switch-Mode Power Supplies

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    Figure 1: The board of an LT8640S switching regulator with closely spaced components and thus a compact board layout

    The Golden Rule of Board Layout for Switch-Mode Power Supplies
    Frederik Dostal, Power Management Expert, Analog Devices

    ­This article explains the basis for achieving an optimized board layout, a critical aspect in the design of switch-mode power supplies. A good layout ensures stable functioning of the switching regulator and minimizes radiated interference as well as conducted interference (EMI). This is widely known by electronics de
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    Date:
    07/01/2026
    Archive

    SandboxAQ to Bring Large Quantitative Models to Google Cloud's Marketplace

    Jun 29,2026

    Molded Power Inductors

    May 29,2026
    Efrain Bernal-Alzate, Design Engineer, Würth Elektronik eiSos

    Now Available from Powell are Compact and Highly Reliable Micro-D SMT Connectors from Winchester

    Apr 30,2026

    Extraordinary AI Performance from -40 to +85°C for Rugged Applications

    Mar 31,2026

     

     

     

     

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