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February 2014
TE Connectivity introduces intelligent buildings solutions
TE Connectivity identified distinct industry demands and leveraged the company’s expertise and resources to form the TE Intelligent Buildings group. TE takes a holistic overview of any building environment and develops connectivity products that design engineers require to solve the electrical interconnection ch
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Date:
02/28/2014
NREL model licensed to improve accuracy of battery simulations
The Energy Department's National Renewable Energy Laboratory (NREL) has licensed its Equivalent Circuit Battery Model to software developer ThermoAnalytics for use in its recently updated RadTherm software package. The model is a part of the Battery Module within RadTherm, which is used by engineers to simulat
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Date:
02/28/2014
AVX claims lowest-profile 0603 & 0805 diplexers available

AVX's 0603 and 0805 MLO diplexers

AVX claims lowest-profile 0603 & 0805 diplexers available
AVX, a leading manufacturer of advanced passive components and interconnect solutions, offers the lowest profile 0603 and 0805 multilayer organic diplexers available in the market.  Compared to equivalent low temperature co-fired ceramic (LTCC) products, AVX's 0603 and 0805 MLO diplexers exhibit superior att
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Date:
02/28/2014
Cymbet launches ultra-low power EnerChip RTC with integrated battery

EnerChip RTC product family

Cymbet launches ultra-low power EnerChip RTC with integrated battery
Cymbet announced the commercial release of the EnerChip™ RTC product family that combines an ultra-low power Real Time Clock with a rechargeable solid state battery and power management IC in a single 5mm x 5mm plastic package. The EnerChip RTC is the world’s smallest RTC with integrated power holdover. Th
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Date:
02/28/2014
Freescale shrinks smallest ARM-Based MCU by an additional 15%

Kinetis KL03 MCU

Freescale shrinks smallest ARM-Based MCU by an additional 15%
Freescale Semiconductor announced a breakthrough addition to its Kinetis mini portfolio with the introduction of the Kinetis KL03 MCU, the world’s smallest and most energy efficient 32-bit MCU based on ARM® technology. The Kinetis KL03 MCU builds on the previous generation Kinetis KL02 device with new features, ad
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Date:
02/27/2014
Fairchild’s 650V green-mode buck switches offer high efficiency and design scalability

FSL306 and FSL336 650V Green Mode AC Buck Switches

Fairchild’s 650V green-mode buck switches offer high efficiency and design scalability
Home appliance, industrial motor and smart meter applications require solutions that provide low standby power in order to achieve energy efficiency for the end user. At the same time, designers need power scalability to increase the power rating of a device for additional system functionality while simplifying de
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Date:
02/26/2014
eConais' EC19D highly-integrated 802.11b/g/n Wi-Fi modules claim lowest standby power
eConais, a leader in ultra low power miniature Wi-Fi module solutions for the Internet of Things, has announced the world’s smallest, most easily integrated, and lowest standby power single chip 802.11b/g/n Wi-Fi System In Package (SiP) modules for the Internet of Things. To help speed the design of products
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Date:
02/26/2014
Maxim shows their intelligent energy sub-metering solution at embedded world 2014 (PSDtv)
In this episode of PSDtv Christian Gruber of Maxim describes their latest sub-metering solution to empower smart homes and other intelligent energy management solutions at the 2014 embedded world conference. Maxim Integrated
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Date:
02/26/2014
Micrel's 85V half-bridge MOSFET driver offers adaptive dead time and shoot-through protection
Micrel, an industry leader in high performance linear and power solutions, LAN and timing and communications solutions, introduced the MIC4605 85V half-bridge MOSFET driver that features Adaptive-Dead-Time and Shoot-Through Protection. The Adaptive-Dead-Time circuitry actively monitors the Half Bridge to minimize th
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Date:
02/25/2014
Vishay's P-Channel Gen III MOSFET offers RDS(on) Down to 0.0016 Ω at -10V in a PowerPA SO-8 Package

TrenchFET p-channel Gen III power MOSFETs

Vishay's P-Channel Gen III MOSFET offers RDS(on) Down to 0.0016 Ω at -10V in a PowerPA SO-8 Package
Vishay Intertechnology extended its offering of TrenchFET® p-channel Gen III power MOSFETs with a new device that offers the lowest on-resistance ever for a p-channel MOSFET. Designed to increase efficiency in mobile computing devices, the -20 V Vishay Siliconix Si7157DP offers on-resistance of 0.0016 Ω and 0.
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Date:
02/25/2014
NPL project could completely change the refrigeration industry
Scientists at the National Physical Laboratory (NPL) and Imperial College are working to make the inefficient method of refrigeration and air conditioning - which has been relied on for over a hundred years - a thing of the past. A new project sets out provide a more economical, energy efficient and environme
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Date:
02/25/2014
IDTechEx to launch smart glass forum at Energy Harvesting Europe 2014
Smart glass is a portfolio of new technologies which are based on new achievements in material science, demands on energy efficiency and comfort and smart building automation requirements and are reaching a new momentum. This is not technology hype but the matureness of technologies and emergence of new ones th
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Date:
02/21/2014
Microchip’s low-power sensor hub makes sensor fusion easy

SSC7102 low-power turnkey sensor hub

Microchip’s low-power sensor hub makes sensor fusion easy
Microchip Technology, a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced the SSC7102—a low-power, flexible and turnkey sensor hub that makes implementing sensor fusion easy and provides an extremely large selection of supported sensors. In fact, Microchip directly pa
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Date:
02/21/2014
International Rectifier to present power solutions at APEC 2014
International Rectifier, a  leader in power management technology, announced it will showcase the company’s latest power management solutions at the Applied Power Electronics Conference and Exposition (APEC) which is being held at Fort Worth Convention Center, Fort Worth, Texas, March 16-20, 2014. IR en
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Date:
02/21/2014
AVX expands capacitance values and voltage ratings in C0G (NP0) MLCCS

AVX high-reliability C0G (NP0) dielectric multilayer ceramic capacitors

AVX expands capacitance values and voltage ratings in C0G (NP0) MLCCS
AVX, a leading manufacturer of advanced passive components and interconnect solutions, has expanded its range of high-reliability C0G (NP0) dielectric multilayer ceramic capacitors (MLCCs). Available in case sizes spanning 01005 to 2225, voltages up to 500V, and capacitance tolerances as low as ±0.1pF, AVX’s C0
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Date:
02/21/2014
Vishay low-profile, high-current Dale IHLP 1616 power inductors now available from TTI

Vishay low-profile, high-current Dale IHLP 1616 power inductors

Vishay low-profile, high-current Dale IHLP 1616 power inductors now available from TTI
Vishay’s latest low-profile, high-current Dale IHLP 1616 power inductors enhance space and power savings in DC/DC converter applications, and can now be sourced through TTI, a leading specialist distributor of passive, connector, electromechanical and discrete components. The surface-mount Dale devices improve bat
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Date:
02/21/2014
Avnet demonstrates Microsemi FPGA value in hands-on SpeedWay design workshops
Avnet Electronics will host a series of SpeedWay Design Workshops™, featuring Microsemi’s low-power, cost-optimized IGLOO®2 FPGAs. The workshops, taught by Avnet technical experts, kick off Feb. 25 in San Jose, Calif., and will be held in 26 cities throughout North America. As one of the largest distribut
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Date:
02/19/2014
The international industry for printed electronics meets at LOPEC
A key factor for the success of printed electronics is networking among companies along the entire value chain. LOPEC in Munich, which has the most prominent international exhibitors and conference speakers in the sectors for materials, systems, production and applications, is the most important platform for ne
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Date:
02/19/2014
Nordic Semiconductor unveils smart Bluetooth solution for Rezence wireless charging

Rezence is a wireless power transfer technology and specification based on the principles of magnetic resonance.

Nordic Semiconductor unveils smart Bluetooth solution for Rezence wireless charging
Ultra low power (ULP) RF specialist Nordic Semiconductor announced the immediate availability of the S120 8-link central protocol stack and the nRF51 Wireless Charging Software Development Kit (SDK) for wireless charging applications based on the Rezence™ standard, developed and maintained by the Alliance fo
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Date:
02/19/2014
Revised PMBus protocol specification V1.3 to be introduced at APEC 2014
During the Applied Power Electronics Conference and Exposition (APEC), held at the Fort Worth Convention Center, the revised PMBus Power System Management Protocol Specification V1.3 will be introduced. Power Electronics Standards session IS2-1-5, “An Introduction to Revision 1.3 of the PMBus Specification” wi
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Date:
02/18/2014
Digital power cuts time-to-market for industrial applications
Patrick Le Fèvre, Ericsson Power Modules

Given the range of industrial applications is extremely diversified  – from very small sensors powered by energy harvesting to mega processors used for process control and huge data computing capabilities required by some industrial equipment – the challenge for power designers remains the selection of
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Date:
02/18/2014
Ultra-low power Cirrus Logic voice processors offer integrated SoundClear technology

Cirrus Logic CS48LV12/13 voice processors

Ultra-low power Cirrus Logic voice processors offer integrated SoundClear technology
Cirrus Logic, a leader in high-precision analog and digital signal processing components, is extending its portfolio of market-leading portable audio ICs with a line of voice processors for mobile applications. The ultra-low power Cirrus Logic CS48LV12/13 voice processors with integrated SoundClear® technology ele
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Date:
02/18/2014
Boosting output in high-voltage op-amps with a current buffer
Joe Kyriakakis, Apex Microtechnology

Delivering more than 200mA of output current can be a serious challenge for many high-voltage operational amplifiers. But for high voltage applications requiring as much as 1A of current, it is possible to meet this spec by pairing a current buffer with the op amp. What the current buffer brings to this arrangement is
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Date:
02/18/2014
Life to Return to the Power Supply Industry in 2014

Jonathon Eykyn, IHS Technology

Life to Return to the Power Supply Industry in 2014
Jonathon Eykyn, IHS Technology

The global market for power supplies crashed in 2012 as economic uncertainties led to low consumer demand and the postponement of large industrial projects. Whilst 2013 bought growth, it was limited to a few markets and the overall market grew by just 2.4%. However, the outlook for the global power supply market is
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Date:
02/17/2014
Focused Ion Beam circuit edit improves power device design
Taqi Mohiuddin, Evans Analytical Group

Designers of power control devices and those that combine control with power FET functionality are finding that FIB circuit edit techniques proven at older process nodes are delivering even greater benefits when used at advanced technology nodes.   It is also expected that FIB circuit edit techniques wi
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Date:
02/17/2014
Powering low-voltage devices from an intermediate-bus voltage
Willie Chan & Jason Sekanina, Linear Technology

Intermediate bus voltages from 24V to 28V (nominal) are commonplace in industrial, aerospace and defense systems, where series-connected batteries may be a backup power source and 12V bus architectures tend to be impractical due to distribution losses. The widening voltage gap between the system bus and the po
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Date:
02/17/2014
Innovation takes center stage at electronica China and productronica China 2014
With more than 800 exhibitors, 57,500 square meters, the 13th electronica China and productronica China will be held on March 18-20, 2014 in halls W1, W2, W3, W4 and W5 at Shanghai New International Expo Center. This year, the two trade fairs will unveil the latest technology products and solutions including
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Date:
02/17/2014
Lattice Semiconductor to present their latest solutions at Embedded World 2014
Lattice Semiconductor will demonstrate new USB3 and Human Machine Interface (HMI) solutions, and address how embedded designers can use low-power, low-cost FPGAs (Field Programmable Gate Arrays) to overcome the challenges of implementing MIPI interfaces at the Embedded World Exhibition and Conference taking pl
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Date:
02/17/2014
Researchers build nonflammable lithium ion battery

Battery fires are a problem for device safety

Researchers build nonflammable lithium ion battery
In studying a material that prevents marine life from sticking to the bottom of ships, researchers led by chemist Joseph DeSimone at the University of North Carolina at Chapel Hill have identified a surprising replacement for the only inherently flammable component of today's lithium-ion batteries: the electrolyte. The work, publ
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Date:
02/14/2014
Leti and STMicro demonstrate ground-breaking DSP at ISSCC 2014
CEA-Leti and STMicroelectronics have presented the successful demonstration of an ultra-wide-voltage range (UWVR) digital signal processor (DSP), based on 28nm ultra-thin body buried-oxide (UTBB) FD-SOI technology. The device, produced by ST in their 28nm UTBB fully depleted SOI process technology, allows bo
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Date:
02/14/2014
Jumpstart IoT designs with STMicro's NFC Discovery Kit

ST’s M24SR Discovery Kit

Jumpstart IoT designs with STMicro's NFC Discovery Kit
At Embedded World 2014, STMicroelectronics will unveil an easy-access development platform for its M24SR dynamic NFC tags that are now entering volume production in all memory densities and package options. Accelerating the design of IoT applications, ST’s M24SR Discovery Kit contains everything engineers ne
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Date:
02/13/2014
Lattice Semiconductor to demonstrate USB3 & HMI solutions with papers on MIPI interfacing at Embedded World
Lattice Semiconductor will demonstrate their latest USB3 and Human Machine Interface (HMI) solutions, and address how embedded designers can use low-power, low-cost FPGAs (Field Programmable Gate Arrays) to overcome the challenges of implementing MIPI interfaces at the Embedded World Exhibition and Conference ta
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Date:
02/13/2014
Latest Osram LED packs more power for projectors
Osram Opto Semiconductors has introduced two high-power versions of the Osram Ostar Projection LED for projectors with a brightness of up to 1700 lumens. Thanks to their optimized design, they offer very high luminous flux from the available chip surface. Between 1000 and 8300 lumens can be produced, depending on
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Date:
02/13/2014
Putting the power in power-dressing

energy harvesting textile

Putting the power in power-dressing
Scientists in the UK developing wearable electronics have knitted a flexible fabric that delivers twice the power output of current energy harvesting textiles. There is considerable interest and research into wearable piezoelectric energy harvesters that use waste energy from human movement or the ambient e
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Date:
02/13/2014
MIPI BIF-compliant battery-management IC from Infineon enables accurate fuel-gauging in mobile devices
Infineon Technologies’ ORIGA™ 3 battery-management IC protects smartphone and tablet computer users from unpleasant surprises. Its proprietary PrediGauge technology allows for highly accurate fuel gauging thus minimizing the risk of unexpectedly running out of power. The batteries in mobile devices operate u
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Date:
02/12/2014
Reduce EMI & improve efficiency with a switcher design
Christian Kueck, Linear Technology

Switching regulators are an excellent replacement for linear regulators in areas where low heat dissipation and high efficiency are valued. The switching regulator is typically the first active component on the input power bus line, and therefore has a significant impact on the EMI performance of the complete co
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Date:
02/11/2014
Electronic Cicuits World Convention 2014 program published
The conference program of the 13th Electronic Cicuits World Convention (ECWC13) has been released. In more than 120 speeches, experts from Europe, Asia and America present the most recent developments in the PCB and SMT sector. One highlight of the event is the Opening Ceremony on 7 May 2014 with keynote speec
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Date:
02/10/2014
Newark element14's IoT development board to cause waves in Android Development Kit Space

Revolutionizing the Internet of Things (RIoT) board

Newark element14's IoT development board to cause waves in Android Development Kit Space
Newark element14, a high-service distributor of technology products and engineering solutions, is launching an exclusive open-source, single board platform, the Revolutionizing the Internet of Things (RIoT) board. The RIoT board is designed to run Android operating systems efficiently, and features a high processing pe
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Date:
02/06/2014
STMicro's energy-harvesting IC expands battery-free application space
STMicroelectronics, a semiconductor leader serving customers across the spectrum of electronics applications, is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Ge
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Date:
02/05/2014
Maxim creates a more integrated experience at Embedded World 2014
At the 2014 Embedded World Exhibition and Conference in Nuremberg, Germany (February 25 – 27, 2014), Maxim Integrated will demonstrate the advantages of highly integrated analog solutions. Maxim will host interactive demo kiosks with embedded solutions for energy management, power management, and the signal-chain. Al
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Date:
02/04/2014
Ericsson 3E EPM Hands on Digital Power Episode 1 (Video)
Introduced by Ericsson in 2008, 3E (Enhanced performance, Energy management and increased End-user value) digital power products and solutions became the reference, and preferred topology, in terms of boards and sub-systems energy optimization. Supporting systems architects and board power designers, the E
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Date:
02/04/2014
Using firmware for efficiency in battery-powered devices
Dave McGownd, Agilent Technologies

Battery powered products are commonplace today. Whether it’s a pace maker, smoke detector, cell phone, or high-end computing device, battery life is a big concern. Electronic hardware has evolved to handle these low power needs. Processors have many different power modes depending on what is required. And RF
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Date:
02/04/2014
Harwin launches EZ-BoardWare SMT components to provide simple, cost-saving connections
EZ BoardWare is the name of a whole family of products from Harwin, a leading hi-rel connector and SMT manufacturer. The surface mount (SMT) products can improve manufacturing flexibility, reduce manufacturing costs, and improve in-field maintenance. Often, relatively simple issues can frustrate good board design an
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Date:
02/03/2014
TI unveils a nano-power regulator that delivers 94.6% peak efficiency in a 30x30-mm footprint

TI's 750-mA LMR22007 switching regulator

TI unveils a nano-power regulator that delivers 94.6% peak efficiency in a 30x30-mm footprint
Texas Instruments has claimed the high ground in board-level power with the industry’s smallest 12-V, 750-mA DC/DC power regulator. The SIMPLE SWITCHER® regulator puts high performance into tiny packaging to drive space-constrained and power-dense applications in a variety of markets, including consumer, ind
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Date:
02/03/2014
Maxim complete smart-meter SoC wins Elektra Award

Elektra European Electronics Industry Award for Maxim Integrated's Zeus

Maxim complete smart-meter SoC wins Elektra Award
Maxim Integrated has won a 2013 Elektra European Electronics Industry Award for Zeus, its highly integrated smart meter system-on-a-chip (SoC). Zeus combines accurate metrology, multiple layers of security and a wide range of communication functions on a single chip. Zeus met the independent jury’s criteria
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Date:
02/03/2014
Nordic Semi releases nRF Toolbox for Bluetooth smart development on Android

nRF Toolbox is a standalone application that also holds the capability of interacting with other Nordic Bluetooth low energy tools as plugins

Nordic Semi releases nRF Toolbox for Bluetooth smart development on Android
Ultra-low-power (ULP) RF specialist Nordic Semiconductor announced the development of an end-to-end solution from actual radio hardware to app (software program) source code for smartphones and tablets running either iOS or Android 4.3 and newer. With Google's integration of native support of Bluetooth® low ene
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Date:
02/03/2014
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