Automotive & Transportation

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Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems

Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems

­Renesas Electronics Corporation introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (H
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Date:
03/27/2025
Wevo Energy Unveils ‘Olivia’ – The First AI Phone Agent for EV Charging Support

Olivia is continuously learning from real-time customer experiences to ensure she is always up-to-date and ready to address an unprecedented range of queries

­Wevo Energy, a leading provider of EV charging management software powering EV charging fleets all over the globe, today announced the launch of Olivia –the first AI phone support agent purpose-built for the electric vehicle charging sector. Available today for Wevo-operated EV charging fleets, th
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Date:
03/26/2025
Taiwan Semiconductor Adds 80V/100V Power MOSFETs to its High-Performance PerFET Family

Taiwan Semiconductor Adds 80V/100V Power MOSFETs to its High-Performance PerFET Family

­Taiwan Semiconductor (TSC) has expanded its PerFET family of power MOSFETs with the addition of 80V and 100V versions. Based on TSC’s proprietary PerFET device structures and processes, the new 80V/100V N-channel power MOSFETs offer a best-in-class figure of merit (FOM: RDS(on)*Q = 184) and an industry-le
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Date:
03/25/2025
Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications

Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications

­Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified de
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Date:
03/25/2025
Microchip Technology Unveils 32-bit MCU Family with Integrated High-Performance Analog Peripherals

Microchip Technology Unveils 32-bit MCU Family with Integrated High-Performance Analog Peripherals

­To address the increasing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology has released the PIC32A family of MCUs. Enhancing the company’s already robust 32-bit MCU portfolio, PIC32A MCUs are designed to be cost-efficient, high-performance so
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Date:
03/11/2025
PSDcast – What the Proposed Auto Tariffs Could Mean for the Industry (Particularly EVs)

Danielle Spalding of Cirba Solutions

­Shortly after assuming office for the second time, President Trump instituted a 25% tariff on all items from Mexico and Canada (excepting energy resources from the latter, which have a lower 10% tariff), and along with all that, an additional 10% on top of existing tariffs for China. We’d like to take a lo
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Date:
03/07/2025
Enhancing Ethernet Switch Reliability with Antaira Corrosion-Resistant Conformal Coatings

The Antaira LMP-1204G-SFP-bt-T-CC is a conformally coated 802.3bt PoE++ industrial Ethernet switch designed to operate in demanding conditions while ensuring reliable PoE power delivery

Choosing a hardened, corrosion-resistant Ethernet switch is critical to preserving industrial control system performance and dependability in settings like chemical plants, wastewater treatment plants, seaports, or traffic monitoring locations. This article explores practical strategies for reducing the risk
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Date:
03/07/2025
Accelerating and Simplifying Software Development: Infineon Launches Drive Core for AURIX, TRAVEO and PSOC

Drive Core bundles pre-integrated software and tools from Infineon and third-party providers to facilitate a rapid start into automotive software development.

­Infineon Technologies AG is launching Drive Core, a scalable software bundle portfolio for AURIX™, TRAVEO™ and PSOC™ that facilitates a rapid start into automotive software development. Drive Core bundles pre-integrated software and tools from Infineon and third-party providers ready-to-use under a three-month ev
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Date:
03/07/2025
Valeo and TactoTek Announce Collaboration for Innovative Automotive Lighting Solutions

Maurizio Martinelli, CEO of Valeo LIGHT Division

­Valeo, a global leader in automotive lighting systems, and TactoTek, the global leader of In-Mold Structural Electronics (IMSE) technology, announced that Valeo has licensed TactoTek IMSE technology to offer advanced interior and exterior lighting applications. Lighting is becoming increasingly important
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Date:
03/07/2025
LLC Switcher IC From Power Integrations Delivers 1650 W of Continuous Output Power

LLC Switcher IC From Power Integrations Delivers 1650 W of Continuous Output Power

­Power Integrations announced a two-fold increase in power output from the HiperLCS™-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up to 1650 W of continuous output power with over 98 percent efficiency. The new family member ta
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Date:
03/05/2025
Testing Battery-Management-System ICs

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Figure 1. The various BMS functional blocks can be tested using the instruments listed in the parentheses.

­Batteries are the ubiquitous powerhouses running portable electronics, power tools, energy-storage systems, e-bikes and e-scooters, and electric automobiles and buses. For optimum performance, battery packs in such products require sophisticated battery-management-system (BMS) ICs to optimize performance and ma
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Date:
03/01/2025
The Data Center on Wheels

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Figure 1: Communication breakdown: Communication between the rear right camera (red) and rear left camera requires a trip to the front of the car in domain architectures and connection to the right front brake (yellow) is impossible. In zones, it is a direct connection....

­EVs can contain 3x or more chips than internal combustion engine (ICE) vehicles depending on the complexity of the vehicle. The growth of the silicon footprint in cars has paved the way for things like lane change sensors, infotainment consoles, downloadable apps, etc. - electronics have fundamentally changed th
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Date:
03/01/2025
Power Interconnects from Hybrids to Electric Vehicles

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­The ongoing evolution in hybrid and electric vehicles (EV) will involve improving the performance and efficiency of inverters, on-board chargers, batteries, and traction motors. With hybrids and EVs, there is a direct relationship between weight and range, so automotive original equipment manufacturers (OEM) ar
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Date:
03/01/2025
Using Fewer Parallel MOSFETs to Meet Thermal Demands

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Figure 1. Six D2PAK MOSFETs with a total footprint area of 1,107 mm2

­Today's automotive and industrial applications are faced with ever increasing performance demands. Power applications like inverters for electric vehicles (EV) and light electric vehicles (LEV), brushless DC motors, DC-DC converters, power switches and battery management systems can easily dissipate several kil
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Date:
03/01/2025
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