Fort Worth, Texas – TTI, Inc. is now stocking SpeedEdge from Molex.
Molex’s SpeedEdge Edge-Card Connector System is rugged enough to mate safely with large PCBs in high cycle application. It provides a high density, low profile solution that offers data rates over 40 Gbp/s per differential pair. As part of the SpeedMezz family of connectors, SpeedEdge gives you yet another versatile option for your high speed, low profile connection needs. This is a new and exciting Edge-Card Connector System available today from TTI.
Features
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Mechanically robust with thicker walls and higher stack height when compared to SpeedStack Connectors and other mezzanine systems
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Securely holds thick PCBs; delivers durability and high-mating cycles
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Split-pad PCB design
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Allows for electrical tuning performance to reach data rates to more than 40Gbps per differential pair
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Design includes contacts with gradual lead-in
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Lessens risk of contact stubbing and supports high-mating cycles. Accommodates PCBs with blunt chamfers
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Multiple circuit sizes (22, 60 and 82) with a range of 6 to 32 differential pairs
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Offers high-density signal solution with flexible pin counts
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Low profile (as low as 7.00mm)
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Delivers superior signal integrity performance via optimal airflow. Provides real estate savings in space-constrained applications
https://www.ttiinc.com/content/ttiinc/en/about/press-releases/2019/january/pr-01252019-tti-stocking-neopress-high-speed-mezzanine-connectors-from-molex.html
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