Date
10/08/2011
TDK-EPC, a group company of TDK Corporation, presents the new TFSB series of TDK thin-film band pass filters, which with a footprint of 1.0 x 0.5 mm2 and an insertion height of just 0.3 mm are the world's smallest*. Thanks to their innovative terminal configuration on their bottom surface the footprint of the low-profile 1005 components is about 50 percent less than for conventional filters. The new filters are designed for the 2.4 GHz and 5 GHz bands, making them suitable for Bluetooth and WLAN applications in smartphones and other mobile phones. Mass production has started in September 2011. The new filters achieve low-loss signal transmission and high attenuation of unwanted signals, resulting in a high signal quality. The band pass filters were developed by using a thin-film micro-wiring technology that TDK developed for the manufacturing of magnetic heads for hard disk drives. This technology enables the successful combination of outstanding performance characteristics with small dimensions and a low-profile form factor, making the product ideal for RF modules designed for smartphones and other advanced mobile phones. The operating temperature range of the product is -40 to +85 °C. TDK-EPC is continually expanding its portfolio of RF components based on TDK's innovative thin-film technology. In addition to the new band pass filters, this product family also includes capacitors, baluns, couplers and diplexers. Glossary