The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2014. The session, “3D Packaging for Power Electronics,” will present proven and available techniques to implement 3D packaging in power supplies today. In addition speakers from leading research facilities will provide a look into the future. The PSMA-sponsored Industry Session on 3D Packaging for Power Electronics (IS1.5) will take place on Thursday afternoon, March 20, 2014, from 2:00 to 5:30 p.m. at the Fort Worth Convention Center in Fort Worth, Texas.
The power supply industry is continually challenged to increase power density while lowering cost and 3D packaging technologies may provide additional options. 3D Packaging is already being applied in semiconductors, components and power supply designs. The Industry Session will feature seven invited experts from industry and research who will provide attendees with an overview of current applications. They will also offer insights that may enable attendees to anticipate and identify potential opportunities for their companies to participate in markets with this emerging technology.
Co-chairs of the session, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting stated: “This Industry Session will not only be very informative but will also provide an opportunity for attendees to interact with other professionals who are active in the evolving application of 3D Packaging in component and power supply designs.” They added: “We encourage people to register for APEC 2014, make plans to attend the Industry Session on 3D Packaging, and to consider participating in the other PSMA sponsored meetings during the week.”
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