This six pack module is optimized to deliver an excellent fit of system cost and performance to hybrid and small battery electric vehicles. It combines Infineon’s established EDT2 IGBTs with package technologies for compactness, very good thermal management at reduced material cost, and an easy installation.
The global boom of vehicle electrification puts the design of cost-effective traction inverters into focus. In this context, selecting the power module plays an important role; system designers are looking for the best-sized module with the optimal silicon area for the required performance. Within Infineon’s portfolio, the HybridPACK DC6i is positioned between the HybridPACK1 family and the more powerful HybridPACK Drive family.
The new module has the same compact footprint (7.2 cm x 14 cm) as the HybridPACK1 – 25 percent smaller than the HybridPACK Drive – but the available output power is more than 50 percent higher. While the HybridPACK1 uses Infineon’s IGBT3 technology, the HybridPACK DC6i is equipped with the latest EDT2 IGBTs. Furthermore, the new module has six screw connectors to the DC-link capacitor compared to two in the HybridPACK1 family. This enables a low-inductive design with a stray inductance of 15 nH. Finally, Infineon’s patented direct-cooling wave baseplate provides an excellent and cost-effective heat dissipation with a thermal resistance from the IGBT chip junction to the fluid of 0.17 K/W.
The DC6i was designed with an efficient and automized high-volume production in mind: Press-Fit pins and additional guiding elements enable gate driver board mounting in a few seconds compared to traditional selective soldering in more than one minute.
The HybridPACK DC6i is fully qualified according to the AQG324 norm for automotive power modules.
EDT2 technology
Infineon’s EDT2 technology is an automotive micro-pattern trench field-stop cell design optimized for electric drivetrain applications. It offers a blocking voltage of 750 V, a short-term extended operation temperature of 175°C and high short-circuit ruggedness. The design tradeoff between switching and conduction losses is optimized for a real-world driving cycle with excellent light load power losses, leading to an efficiency improvement of 20 percent compared to Infineon’s previous IGBT3 generation.
Availability
The new HybridPACK DC6i is in production and will be available at distributors in September 2020.
PDF
