II-VI Advanced Materials, a leading supplier of
	single crystal SiC (silicon carbide) substrates and CVD-grown
	polycrystalline diamond materials, recently exhibited the world's first
	200mm diameter SiC wafer at the 2015 Compound Semiconductor
	Manufacturing Technology (CS MANTECH) conference in Scottsdale, AZ and
	the International SiC Power Electronics Applications Workshop
	(ISiCPEAW) in Stockholm, Sweden.
	Dr. Thomas Anderson, General Manager of II-VI Advanced Materials said,
	"This achievement is a direct result of our consistent focus on
	providing the market with leading-edge quality substrates at the
	diameters required to enable more cost effective semiconductor device
	manufacturing. The earlier introduction of our 150mm diameter SiC
	substrates was extremely well received by our customers, and
	significant growth in the demand reflects market recognition of the
	improved economics of SiC device manufacturing at increased diameters.
	Devices built on these substrates will be or are currently being
	utilized in a wide range of applications requiring high power density
	and system efficiency, such as electric vehicles, inverters for PV
	solar energy and other renewable energy installations."
	This development program builds upon years of work funded, in part, by
	the U.S. Air Force Research Laboratory (AFRL). It focused on the
	manufacturing scale-up of the II-VI Advanced Physical Vapor Transport
	(APVT) SiC crystal growth technology as well as the development of
	state-of-the-art fabrication, polishing and cleaning processes. These
	efforts have resulted in achievement of world-class quality material
	while at the same time increasing the diameter from 3" to 100mm, then
	to 150mm and now to the world's first 200mm SiC substrates.
	"This 200mm SiC wafer demonstrates our market leading crystal growth
	and fabrication technologies, as well as our commitment to respond to
	and work with our customers to ensure a smooth transition to the next
	generation of substrates. We are dedicated to pushing the boundaries of
	SiC substrate technology to ensure that the market has the material it
	needs to make high performance SiC based devices both cost effective
	and widely utilized," commented Dr. Andrew Souzis, Director of Business
	Development.