μModule Regulators Use Inductor as Heat Sink

ADI’s Power by Linear LTM4626 and LTM4638, 20 VIN μModule (power module) regulators use a 3D packaging assembly dubbed component on package (COP). The inductor is exposed on top of the device. Using the temperature gradient of the inductor, heat from the MOSFET inside is transferred to the inductor, then to air or a heat sink.

Key Features    

• Complete solution in <1 cm2 (single-sided PCB) or 0.5 cm2 (dual-sided PCB)    
• 3.87 mm (LTM4626) and 5.02 mm (LTM4638) package height    
• Wide input voltage range: 3.1 V to 20 V    
• 0.6 V to 5.5 V output voltage

Analog Devices

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